Stacked Semiconductor Package Heat Distribution for Thermal Reliability
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Solution Overview
Problem
Conventional semiconductor packaging methods are inadequate, leading to excessive cost, decreased reliability, and large package sizes due to inadequate thermal dissipation, which results in thermal breakdown and failures.
Innovation Solution
The implementation of a semiconductor package design that includes an internal heat distribution layer on top of the semiconductor die and an external heat distribution layer covering the package, with the external layer thermally coupled to the internal layer to efficiently dissipate heat, along with a method of manufacturing that involves forming an internal electrical interconnect structure and encapsulating the semiconductor die within an encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods are used to package several semiconductor dies together, then the semiconductor dies can be deeply embedded within the semiconductor package, but inadequate thermal dissipation results in thermal breakdown and failures
Solution Approach 1:
The heat distribution layer is divided into multiple segments including an internal heat distribution layer formed on the semiconductor die and an external heat distribution layer formed on the package, with each segment serving to distribute and dissipate heat from different regions of the semiconductor device
Solution Approach 2:
The heat distribution system extends from a two-dimensional surface layer to a three-dimensional structure by forming the internal heat distribution layer within the package and the external heat distribution layer on the package exterior, creating multiple thermal pathways in different spatial dimensions
2Ease of manufacture
If conventional packaging methods are used, then semiconductor dies are deeply embedded within the package, but this results in excess cost and decreased reliability
Solution Approach 1:
The internal heat distribution layer is formed on the semiconductor die before packaging, and the external heat distribution layer is formed on the package before final assembly, allowing thermal management to be integrated into the manufacturing process rather than added as a separate corrective measure
3Area of stationary object
If conventional packaging methods are used, then semiconductor dies are packaged together, but the package sizes become too large due to inadequate thermal dissipation
Solution Approach 1:
The heat distribution functionality is merged into the package structure itself by integrating the internal heat distribution layer with the semiconductor die and the external heat distribution layer with the package, eliminating the need for separate thermal management components that would increase package size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses thermal dissipation issues, enhancing the reliability and reducing costs by ensuring efficient heat dissipation, thereby preventing thermal breakdown and improving the overall performance of semiconductor packages.
Implementation Method 1
an external heat distribution layer covering an external surface of the second semiconductor device and the side surface of the first semiconductor device, wherein the external heat distribution layer is thermally coupled to the internal heat distribution layer
Data Source
AI summary
A semiconductor package having an internal heat distribution layer and methods of forming the semiconductor package are provided. The semiconductor package can include a first semiconductor device, a second semiconductor device, and an external heat distribution layer. The first semiconductor device can comprise a first semiconductor die and an external surface comprising a top surface, a bottom surface, and a side surface joining the bottom surface to the tope surface. The second semiconductor device can comprise a second semiconductor die and can be stacked on the top surface of the first semiconductor device. The external heat distribution layer can cover an external surface of the second semiconductor device and the side surface of the first semiconductor device. The external heat distribution layer further contacts an internal heat distribution layer on a top surface of the first semiconductor die.