Stacked Semiconductor Package Layout for Insulation and Heat Dissipation
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high reliability and efficient fabrication processes, particularly in stacked structures with multiple semiconductor chips, where the integration of different types of chips and the use of through silicon vias (TSV) complicates the bonding and insulation processes.
Innovation Solution
A semiconductor package design that includes a first semiconductor chip with dummy chips below and between it, using through vias and bonding pads for electrical connections, and an insulating layer to improve chip stacking efficiency and reliability, while eliminating insulating material between the semiconductor and dummy chips to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating material is used between semiconductor chips in a stacked structure, then electrical insulation is improved, but heat dissipation is worsened
Solution Approach 1:
The patent segments the insulating structure into two parts: a first insulating layer positioned between the first and second semiconductor chips to provide electrical insulation, and deliberately excludes insulating material between the second semiconductor chip and dummy chips. This segmentation allows heat dissipation at critical interfaces while maintaining electrical insulation where needed.
Solution Approach 2:
The patent applies different insulating properties to different locations within the stacked structure. Insulating material is present between functional semiconductor chips where electrical isolation is required, but absent between the second semiconductor chip and dummy chips where thermal conduction is prioritized for heat dissipation.
2Reliability
If multiple through vias are formed in dummy chips for electrical connection, then electrical connectivity is improved, but fabrication complexity is worsened
Solution Approach 1:
The dummy chips are designed with through vias that serve multiple functions: they provide electrical connection paths between bonding pads and the first semiconductor chip, maintain structural integrity of the stacked package, and enable proper alignment during fabrication. This multi-functionality reduces the need for additional specialized structures.
Solution Approach 2:
The dummy chips replicate the through via structure of functional semiconductor chips, allowing standardized fabrication processes to be applied across all chips in the stack. This copying approach simplifies manufacturing by using uniform processes rather than requiring specialized handling for different chip types.
3Area of stationary object
If different types of semiconductor chips are vertically stacked to increase chip density, then area utilization is improved, but bonding process complexity is worsened
Solution Approach 1:
The first insulating layer acts as an intermediary between the first and second semiconductor chips, providing a standardized interface that simplifies the bonding process. This insulating layer enables consistent bonding conditions across different chip types in the stack, reducing process complexity despite the diversity of stacked components.
4Reliability
If through vias are made to penetrate deep through multiple chips, then electrical connection reliability is improved, but manufacturing precision requirements are worsened
Solution Approach 1:
Through vias are formed in each chip individually before stacking, allowing precise via formation to be performed separately on each chip using optimized processes for that specific chip type. This preliminary action on individual chips before assembly reduces the overall precision requirements compared to forming through-vias across the entire stacked structure in one step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and efficiency of semiconductor packages by facilitating better electrical connections and heat dissipation, reducing fabrication complexity and costs through the use of dummy chips and optimized via placement, and improved bonding and insulation strategies.
Implementation Method 1
a first insulating layer below the second semiconductor chip and below the first and second dummy chips with each of the first, second, and third through vias penetrating the first insulating layer
Implementation Method 2
a first bonding pad bonding the first semiconductor chip to the second semiconductor chip, a second bonding pad bonding the first semiconductor chip to the first dummy chip, a third bonding pad bonding the first semiconductor chip to the second dummy chip
Implementation Method 3
a first through via penetrating the second semiconductor chip and electrically connected to the first semiconductor chip, second and third through vias penetrating the first and second dummy chips, respectively, and each electrically connected to the first semiconductor chip
Data Source
AI summary
A semiconductor package includes a first semiconductor chip, first and second dummy chips below the first semiconductor chip, a second semiconductor chip between the first and second dummy chips, a first through via penetrating the second semiconductor chip and electrically connected to the first semiconductor chip, second and third through vias penetrating the first and second dummy chips, respectively, and each electrically connected to the first semiconductor chip, a first bonding pad bonding the first semiconductor chip to the second semiconductor chip, a second bonding pad bonding the first semiconductor chip to the first dummy chip, a third bonding pad bonding the first semiconductor chip to the second dummy chip, and a first insulating layer below the second semiconductor chip and below the first and second dummy chips with each of the first, second, and third through vias penetrating the first insulating layer.