Stacked Semiconductor Package Layout for Heat and Short Isolation
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Solution Overview
Problem
Stack-type multi-chip semiconductor packages face challenges with increased heat radiation, structural stability, and electrical properties due to the degradation of chips and circuit layers as the number of stacked chips increases, leading to performance issues.
Innovation Solution
A semiconductor package design featuring a first die with signal and dummy regions, and a second die stacked on top, utilizing dummy patterns and pads for improved heat radiation and structural stability, with specific pad arrangements and dielectric layers to enhance electrical connections and reduce the risk of electrical shorts between ground and power circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of stacked chips is increased to improve integration and reduce size, then productivity and functionality are improved, but heat radiation capability deteriorates and chips degrade
Solution Approach 1:
The chip surface is segmented into signal regions and dummy regions, with the dummy region specifically designed for heat dissipation functions. This segmentation allows dedicated thermal management areas that radiate heat without interfering with signal processing, thus enabling higher integration while maintaining heat radiation capability.
Solution Approach 2:
Different regions of the chip are assigned different qualities: the signal region optimizes for electrical performance while the dummy region optimizes for thermal radiation. The dummy patterns in the dummy region have specific geometric configurations that enhance heat radiation locally, allowing the overall system to maintain good heat dissipation even with multiple stacked chips.
2Productivity
If the number of stacked chips is increased to improve integration, then productivity is improved, but structural stability deteriorates due to chip degradation
Solution Approach 1:
Dummy patterns are pre-configured in the dummy region before chip operation, creating a stable structural framework that supports the chip stack. These dummy patterns form rigid geometric structures that enhance mechanical stability and prevent chip degradation, allowing higher stacking without compromising structural integrity.
Solution Approach 2:
The chip structure combines signal regions with dummy regions containing patterns made of materials optimized for mechanical strength. This composite structure integrates both electrical functionality and structural support, enabling stable multi-chip stacking by distributing mechanical stresses through the dummy pattern framework.
3Temperature
If dummy patterns are added to improve heat radiation and structural stability, then thermal and mechanical performance are improved, but device complexity increases
Solution Approach 1:
The heat dissipation and structural support functions are extracted from the signal processing region and placed in a separate dummy region. This extraction allows dummy patterns to be optimized purely for thermal and mechanical performance without complicating the signal circuit design, thus improving heat radiation and stability while minimizing impact on overall device complexity.
Solution Approach 2:
The dummy patterns serve multiple functions simultaneously: they provide heat radiation surfaces, enhance structural stability, and occupy space that would otherwise be unused. This multi-functionality allows a single structural feature to address multiple concerns (thermal and mechanical) without proportionally increasing complexity, as the same dummy structures fulfill multiple roles.
4Reliability
If multiple dummy patterns are arranged to improve electrical properties and reduce electrical shorts, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The dummy patterns are arranged in asymmetric configurations that naturally create electrical isolation between adjacent patterns. By using non-uniform spacing and orientations, the design reduces the likelihood of electrical shorts without requiring perfectly symmetric and precise alignment, thus improving reliability while moderating manufacturing precision demands.
Solution Approach 2:
Dielectric layers are introduced as intermediary materials between adjacent dummy patterns and pads. These dielectric layers provide electrical insulation and prevent shorts, allowing dummy patterns to be arranged more freely without stringent precision requirements. The dielectric intermediary buffers against manufacturing variations while maintaining electrical isolation and improving overall reliability.
Data Source
AI summary
A semiconductor package includes a first die having signal and dummy regions, and a second die on the first die. The first die includes first dummy patterns arranged in a first direction on the dummy region, second dummy patterns on the dummy region and between the first dummy patterns, a first dielectric layer on the first and second dummy patterns, and first pads extending through the first dielectric layer and coupled to the first dummy patterns. The second die includes second pads on the dummy region, and third pads on the dummy region. On an interface between the first and second dies, the first pads are in contact with the second pads. The first dielectric layer is between the second dummy patterns and the third pads. The first dummy patterns are connected to a ground circuit or power circuit of the first die.