Stacked Semiconductor Package Layout for Better Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges in achieving higher performance, larger capacity, and miniaturization while effectively managing heat dissipation.
Innovation Solution
Incorporation of dummy patterns around through-vias on semiconductor chips, connected to back pads, which enhance heat dissipation by providing a thermally conductive path without affecting the vertical stacking gap between chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor chips are stacked vertically to achieve miniaturization and higher capacity, then device density and capacity are improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces dummy patterns that extend in the horizontal plane (first and second directions) connected to back pads, creating additional thermal conduction paths in the lateral dimension. This complements the vertical stacking approach by adding horizontal heat dissipation routes through the dummy patterns and back pads structure, effectively managing heat in 3D space without compromising vertical integration density.
2Temperature
If dummy patterns are added around through-vias to improve heat dissipation, then thermal conduction is enhanced, but device complexity increases
Solution Approach 1:
The dummy patterns serve multiple functions simultaneously: they act as thermal conduction paths for heat dissipation, provide structural support around through-vias, and can be integrated with existing pad structures. The back pads connected to dummy patterns create a multi-functional element that handles both electrical connection and thermal management, reducing overall device complexity despite the added thermal management capability.
3Temperature
If dummy patterns are arranged to overlap multiple back pads to maximize thermal pathways, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The dummy patterns are designed and positioned in advance during the chip fabrication process, with predetermined connections to specific back pads. The overlapping arrangement of dummy patterns with multiple back pads is pre-planned in the layout stage, allowing for systematic alignment procedures and reducing the complexity of real-time manufacturing adjustments. This preliminary planning enables controlled thermal pathways without excessive precision demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation characteristics of semiconductor packages by creating an additional thermal pathway, maintaining structural integrity and electrical connectivity.
Implementation Method 1
dummy patterns arranged around the through-vias and such that at least one surface of each of the dummy patterns is exposed to the back surface... at least one of the dummy patterns overlaps two or more second back pads
Data Source
AI summary
A semiconductor package may include a first semiconductor chip including a substrate having opposing front and back surfaces, through-vias extending from the front surface toward the back surface, dummy patterns arranged around the through-vias and such that a surface of each of the dummy patterns is exposed to the back surface, a plurality of first back pads arranged on the through-vias, and a plurality of second back pads arranged on the surface of each of the dummy patterns. A second semiconductor chip may be on the first semiconductor chip, and may include a plurality of first front pads and a plurality of second front pads. In a plan view, at least one of the dummy patterns overlaps two or more second back pads arranged in at least one direction of a first direction and a second direction.