Stacked Semiconductor Package Heat Slug Structure for Thermal Dissipation
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Solution Overview
Problem
Existing semiconductor packages face challenges in effectively dissipating heat, particularly in stacked structures where heat generated by lower packages is not efficiently transferred and dissipated to the outside.
Innovation Solution
The semiconductor package incorporates a heat slug structure comprising a heat slug pad and heat slug posts with high thermal conductivity, which are disposed under a heat slug pattern and thermal interface material layer. This configuration serves as a heat dissipation passage, facilitating the transfer and dissipation of heat generated within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If packages are vertically stacked on the fan-out wafer level package to increase integration density, then the quantity of semiconductor devices is improved, but heat dissipation characteristics deteriorate
Solution Approach 1:
The heat slug structure extends heat dissipation pathways from the lower package through the sealing member to the upper package, utilizing the vertical dimension to conduct heat away from the stacked configuration. The heat slug penetrates through multiple layers (sealing member, upper redistribution layer structure) to establish thermal pathways in the depth dimension, enabling effective heat management in the vertically stacked architecture.
Solution Approach 2:
The heat slug acts as an intermediary thermal conduction element between the lower package heat source and the upper package heat dissipation structures. It mediates heat transfer through the sealing member and connects to the heat slug pad and heat slug pattern, facilitating thermal energy transfer across package boundaries while maintaining the stacked configuration.
2Temperature
If a heat slug structure with high thermal conductivity materials is introduced to improve heat dissipation, then heat dissipation characteristics are improved, but device complexity increases
Solution Approach 1:
The heat slug structure merges multiple functional elements into an integrated heat dissipation system. The heat slug, heat slug pad, and heat slug pattern are combined to form a continuous thermal pathway that works across package boundaries. This merged structure provides comprehensive heat dissipation functionality while avoiding the need for separate, independent cooling systems for each package layer.
Solution Approach 2:
The heat slug structure serves multiple functions simultaneously: it conducts heat from the lower package, transfers heat through the sealing member, provides thermal pathways in the upper package, and interfaces with existing redistribution layer structures. This multi-functional design achieves effective heat dissipation without requiring entirely separate cooling systems, thereby limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the heat slug structure significantly enhances the heat dissipation characteristics of the semiconductor package, effectively managing heat transfer from lower to upper packages and ensuring efficient dissipation of heat to the outside, thereby improving the operating reliability and longevity of the semiconductor devices.
Implementation Method 1
a thermal conductivity of the heat slug pad and a thermal conductivity of the plurality of heat slug posts is greater than a thermal conductivity of the thermal interface material layer
Data Source
AI summary
A semiconductor package may include a lower redistribution layer structure including lower redistribution layers and a lower semiconductor chip, a sealing member on the lower semiconductor chip, through vias extending into the sealing member, an upper redistribution layer structure on the sealing member, a bonding pad and a heat slug pad on the upper redistribution layer structure, an upper package on the bonding pad, a plurality of heat slug posts on the heat slug pad, a thermal interface material layer on the heat slug pad and the plurality of heat slug posts, and a heat slug pattern on the thermal interface material layer, where the bonding pad is electrically connected to the upper redistribution layers, and where a thermal conductivity of the heat slug pad and a thermal conductivity of the plurality of heat slug posts is greater than a thermal conductivity of the thermal interface material layer.