Stacked Electronic Package with Heat Spreader and Through-Die Interconnect
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Solution Overview
Problem
Conventional 2.5D or 3D IC packages face challenges with heat dissipation, leading to potential component breakdown due to poor thermal management, and they lack a molding compound for protection and a redistribution layer for efficient electrical connections.
Innovation Solution
The electronic package incorporates a heat spreading component, an interconnection structure within the second electronic component, and an encapsulant to enhance heat dissipation and protect the components, while also allowing for a redistribution layer to facilitate efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional 2.5D or 3D IC packages are manufactured without a heat spreader, then the manufacturing process is simpler, but heat dissipation is poor leading to component breakdown
Solution Approach 1:
The package structure is segmented into distinct functional layers: a heat spreading component at the bottom, stacked electronic components in the middle, and an encapsulant at the top. This segmentation allows each layer to perform its specific function optimally, with the heat spreading component dedicated to thermal management and the encapsulant providing protection.
Solution Approach 2:
The heat spreading component acts as an intermediary between the stacked electronic components and the external environment. It receives heat from the electronic components and dissipates it laterally, serving as a thermal mediator that protects the sensitive electronic components from direct heat exposure.
2Reliability
If stacked electronic components are formed in a single unit without encapsulant, then the manufacturing process is simpler, but the structures are easily damaged without protection
Solution Approach 1:
The encapsulant serves as a protective shell that envelops the stacked electronic components and heat spreading component. This shell provides mechanical protection, environmental sealing, and structural integrity to the entire package assembly.
Solution Approach 2:
The manufacturing process merges multiple components (heat spreading component, stacked electronic components, and encapsulant) into a single integrated package structure. This combining approach ensures that all components are protected together as a unified assembly while maintaining their individual functions.
3Ease of operation
If stacked electronic components are mounted directly on package substrate without redistribution layer, then the device complexity is reduced, but efficient electrical connections cannot be achieved
Solution Approach 1:
The interconnection structure transitions from a planar two-dimensional layout on the package substrate to a three-dimensional vertical stack. Conductive vias enable electrical connections to extend through the thickness of the encapsulant, allowing efficient interconnection in the vertical dimension while maintaining a compact footprint.
4Power
If power consumption is limited to avoid breakdown, then component reliability is maintained, but the power output is restricted
Solution Approach 1:
The heat spreading component converts the harmful thermal energy that would otherwise cause component breakdown into a manageable thermal flow. By efficiently conducting and dissipating heat laterally, it enables the electronic components to operate at higher power levels without exceeding their thermal limits, thus converting a potential failure mechanism into a controlled thermal management solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation capabilities, protects the stacked electronic components, and enables the integration of a redistribution layer, addressing the limitations of conventional 2.5D or 3D IC packages.
Implementation Method 1
a heat spreading component; improves heat dissipation capabilities
Data Source
AI summary
An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.