Stacked Semiconductor Package Structure for Heat Dissipation and Testing

The patent divides the semiconductor package into multiple independent package structures (first package structure, second package structure, etc.) that are stacked vertically. Each package structure contains its own circuits and can be independently tested, eliminating the need for complex wire bonding between circuits while maintaining high circuit functionality.

The patent transitions from a planar integration approach to a three-dimensional stacked architecture. By arranging package structures in the vertical dimension rather than spreading circuits out horizontally, the patent reduces wire bonding complexity while increasing circuit capacity.

By segmenting the package into multiple independent package structures with separate substrates and encapsulants, heat from each circuit is isolated and can be dissipated independently through dedicated thermal paths, preventing heat accumulation that would occur in integrated planar structures.

The patent introduces intermediary elements such as solder balls, filling layers, and substrate structures that serve as thermal management components. These intermediaries facilitate heat dissipation between package structures and provide thermal pathways that maintain temperature control as circuit functionality increases.

Each package structure is manufactured as an independent unit with pre-established interconnections within its own substrate. This segmentation eliminates the need for complex cross-package wire bonding processes, allowing parallel manufacturing of multiple package structures that are later stacked, thereby improving productivity.

The patent performs preliminary interconnection actions within each individual package structure during its own manufacturing process, before the final stacking assembly. Connection pads, conductive structures, and routing are all established in advance within each package, eliminating the need for subsequent complex wire bonding operations.

The package is segmented into multiple independent package structures that can be individually accessed and tested. Each package structure has its own substrate and encapsulant boundaries, allowing failure analysis to be focused on specific packages rather than requiring disassembly of an integrated structure, thus maintaining testing capability while utilizing vertical space efficiently.

The patent applies partial independence to package structures, where each package is self-contained for testing purposes but can be densely stacked for space utilization. The excessive action of creating fully independent testable units is balanced with the efficient use of vertical stacking to achieve both goals.