Stacked Semiconductor Package With Hybrid-Bonded Passive Component
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Solution Overview
Problem
In semiconductor package technology, passive components like capacitors have long electrical connection paths with semiconductor chips, limiting performance improvement and preventing fine pitch connections to main boards or package boards.
Innovation Solution
The semiconductor package includes a passive component with a short electrical connection path to a semiconductor chip, achieved through hybrid bonding on the first semiconductor chip, allowing for fine pitch connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passive component is mounted side by side with the lower semiconductor chip on a package board or mounted along with solder balls on a lower surface of a main board, then the passive component can be electrically connected to the semiconductor chip, but the electrical connection path becomes long and fine pitch connection is not achieved
Solution Approach 1:
The patent transitions from planar mounting (side by side on package board) to vertical stacking (passive component on lower semiconductor chip). This dimensional change shortens the electrical connection path by eliminating intermediate connection layers and enabling direct bonding between pads on adjacent surfaces, resolving the contradiction between achieving electrical connection and maintaining short path length.
2Reliability
If a passive component is mounted side by side with the lower semiconductor chip on a package board, then the passive component can be electrically connected to the semiconductor chip, but fine pitch connection cannot be implemented
Solution Approach 1:
By moving from 2D planar arrangement to 3D vertical stacking, the patent enables finer pitch connections. The direct bonding interface between the lower semiconductor chip and passive component allows for smaller pad dimensions and tighter spacing, achieving fine pitch connection that is not possible with traditional side-by-side mounting.
3Length of moving object
If hybrid bonding is used to position the passive component on the first semiconductor chip, then the electrical connection path is shortened and fine pitch connection is enabled, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines multiple functions into the hybrid bonding process: mechanical attachment, electrical connection, and positioning are all achieved simultaneously through direct pad-to-pad bonding. This merging of functions, while technically complex, eliminates the need for separate mounting and connection steps, ultimately simplifying the overall manufacturing workflow despite the advanced bonding requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the performance of semiconductor chips by reducing electrical connection path length and enabling fine pitch connections, thereby improving overall package performance.
Implementation Method 1
The positioning of the passive component on the first semiconductor is performed by hybrid bonding
Data Source
AI summary
A semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate; a second semiconductor chip disposed on the first semiconductor chip; a passive component disposed on the first semiconductor chip; and an encapsulant that encapsulates the second semiconductor chip and the passive component. The first semiconductor chip includes a first through via that extends through at least a portion of the first semiconductor chip, and a first pad disposed on a first surface thereof and connected to the first through via. The passive component includes at least one trench and a second pad disposed on a first surface thereof and connected to the trench. The first pad and the second pad are directly bonded by contacting each other.