Stacked Semiconductor Package Routing for Separate IP Core Channels
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Solution Overview
Problem
Existing semiconductor package structures face challenges in fulfilling channel requirements for integrating different components, lacking flexibility in channel design.
Innovation Solution
A semiconductor package structure with a frontside redistribution layer, a stacking structure, a backside redistribution layer, a first intellectual property (IP) core, and a second IP core, where the stacking structure includes a first semiconductor die and a second semiconductor die, with separate routing channels for each IP core to enhance flexibility and optimize routing channel design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate routing channels are implemented for each IP core, then channel design flexibility is improved and interference between channels is prevented, but device complexity increases
Solution Approach 1:
The patent divides the routing channel into separate independent channels for different IP cores. Each routing channel is electrically insulated from the frontside redistribution layer and separated from other routing channels, allowing individual optimization and preventing interference while maintaining manageable complexity through modular organization
Solution Approach 2:
Each routing channel is designed with specific local characteristics tailored to its associated IP core's requirements. The routing channels have different configurations, depths, and electrical insulation arrangements optimized for their respective IP cores, enabling customized routing solutions for each component rather than a uniform approach
2Speed
If multiple semiconductor dies are stacked vertically, then track lengths between components are minimized and electrical performance is improved, but channel integration requirements become more challenging
Solution Approach 1:
The patent transitions from planar routing to three-dimensional vertical routing by stacking semiconductor dies. Routing channels extend through multiple die layers in the vertical dimension, with channels passing through first, second, and third semiconductor dies at different depths. This dimensional change enables shorter signal paths while the complex channel integration is managed through systematic layering and electrical insulation between channels
Solution Approach 2:
Multiple routing channels are nested within the stacked die structure, with each channel positioned at specific depths within the vertical stack. The routing channels are embedded within the semiconductor dies and insulation layers, creating a nested configuration where channels at different levels are electrically insulated from each other and from redistribution layers, enabling dense integration without interference
Data Source
AI summary
A semiconductor package structure having a frontside redistribution layer, a stacking structure disposed over the frontside redistribution layer and having a first semiconductor die and a second semiconductor die over the first semiconductor die. A backside redistribution layer is disposed over the stacking structure, a first intellectual property (IP) core is disposed in the stacking structure and electrically coupled to the frontside redistribution layer through a first routing channel. A second IP core is disposed in the stacking structure and is electrically coupled to the backside redistribution layer through a second routing channel, wherein the second routing channel is different from the first routing channel and electrically insulated from the frontside redistribution layer.