Stacked Semiconductor Package With Isolated Stimulus Passages
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.
Innovation Solution
The development of semiconductor devices with a stacked substrate configuration and integrated housing that provide isolated passages for stimuli communication, utilizing a housing that is more universal and reduces manufacturing costs, allowing for a smaller form factor and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing processes are established, but package sizes are too large and costs are excessive
Solution Approach 1:
The patent merges the housing and substrate into a single integrated structure where the housing is formed as part of the substrate package. This integration eliminates the need for separate housing components and assembly processes, reducing both package size and manufacturing cost while maintaining functional requirements for stimulus isolation and communication.
Solution Approach 2:
The integrated housing-substrate structure serves multiple functions simultaneously: it provides mechanical support, defines isolated chambers for stimulus separation, creates pathways for stimulus communication, and eliminates the need for dedicated molding systems. This multi-functionality reduces overall device complexity and manufacturing expenses.
2Reliability
If conventional semiconductor packages are used, then structural support is provided, but reliability is decreased
Solution Approach 1:
By combining the housing and substrate into one integrated component, the patent reduces the number of interfaces and assembly steps that could introduce failures. The unified structure ensures consistent material properties and bonding characteristics throughout, improving reliability while simplifying the overall package architecture.
Solution Approach 2:
The integrated housing-substrate structure is designed with internally defined segmented chambers that isolate different stimuli while maintaining a unified external structure. This segmentation provides functional isolation for reliability without requiring separate external housing components, thus not increasing device complexity.
3Reliability
If isolated passages are implemented for stimulus communication, then performance is improved, but manufacturing complexity increases
Solution Approach 1:
The passages for stimulus communication are formed as integral features of the integrated housing-substrate structure rather than requiring separate manufacturing steps. The chambers and pathways are defined during the substrate formation process itself, eliminating the need for additional molding or assembly operations to create isolation structures.
Solution Approach 2:
The integrated structure serves as both the mechanical housing and the stimulus isolation system. The same material and formation process that create the structural support also define the isolated chambers and communication pathways, so no separate dedicated molding system is required for the passages.
Data Source
AI summary
In one example, an electronic device includes a substrate structure and a housing. The housing is coupled to the substrate structure and includes a first chamber, a second chamber isolated from the first chamber, a first port comprising a first passage coupled to the first chamber, and a second port comprising a second passage coupled to the second chamber. An electronic component within the first chamber and includes a top side and a lower side opposite to the top side and isolated from the top side. The top side of the electronic component is configured to receive a first stimulus through the first passage and the first chamber, and the lower side of the electronic component is configured to receive a second stimulus through the second passage and the second chamber. Other examples and related methods are also disclosed herein.