Stacked Package Structure With Limiting Connectors Against Collapse
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Stacked package structures often experience structural collapse during the stacking process, leading to reduced process yield and product quality.
Innovation Solution
The implementation of a package structure that includes a first and second redistribution circuit structure, conductive connectors, and a plurality of limiting connectors between packages, which are not entirely made of solder, to enhance structural stability and prevent collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional solder connectors are used for stacking packages, then electrical connection is achieved, but structural collapse occurs during the stacking process
Solution Approach 1:
The limiting connector uses a composite structure consisting of a core material (e.g., metal pillar or post) and a surrounding solder material. This composite design provides both mechanical support (from the core) and electrical connection (from the solder), preventing structural collapse while maintaining connectivity. The core material gives the connector rigidity and strength, while the solder ensures proper electrical bonding between packages.
Solution Approach 2:
The limiting connector is divided into distinct functional parts: a core structural element and an outer solder layer. This segmentation allows each part to perform its specialized function - the core provides mechanical strength to prevent collapse, while the solder provides electrical connection and bonding capability. This division of functions resolves the contradiction between structural stability and electrical connection requirements.
2Reliability
If limiting connectors are introduced to prevent structural collapse, then bonding quality improves, but device complexity increases
Solution Approach 1:
The core material acts as an intermediary structural element between the upper and lower packages. Instead of relying solely on solder (which is soft and provides poor mechanical support), the core material serves as a rigid mediator that maintains spacing and prevents collapse during the stacking process. This intermediary structure simplifies the overall system by providing a clear mechanical support function that the solder alone cannot fulfill.
Data Source
AI summary
A package structure including a first redistribution circuit structure, a chip, a second redistribution circuit structure, a plurality of packages, and a plurality of limiting connectors is provided. The chip is disposed on the first redistribution circuit structure. The second redistribution circuit structure is disposed on the chip. The plurality of packages are disposed on the second redistribution circuit structure. Each of the packages includes an encapsulant. The plurality of limiting connectors are disposed between each of the packages and the second redistribution circuit structure.