Stacked Semiconductor Package With Expandable Memory Interface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor technologies face challenges in increasing the capacity and performance of semiconductor packages due to limitations in interconnecting multiple semiconductor chips in a three-dimensional stacked structure.
Innovation Solution
A semiconductor package is designed with an expandable interface circuit on a stacked semiconductor device, allowing for the connection of additional expanded memories through a base die with multiple physical interface circuits, enabling efficient signal transmission and expansion of memory capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are stacked vertically to increase capacity, then the memory capacity and performance are improved, but the complexity of interconnection and interface design increases
Solution Approach 1:
The interface circuit is divided into multiple independent physical interface circuits (first physical interface circuit, second physical interface circuit, third physical interface circuit), each handling specific communication tasks with different chips. This segmentation allows complex interconnection requirements to be broken down into manageable, independent interface modules, reducing overall design complexity while supporting multiple stacked chips.
Solution Approach 2:
The base die is designed with multiple physical interface circuits that can serve different functions - the first interface circuit interfaces with expanded memory, the second with the stacked semiconductor device, and the third with additional expanded memory. This multi-functionality allows a single base die to support various configuration scenarios, reducing the need for multiple specialized components.
2Quantity of substance
If additional expanded memory chips are connected to increase package capacity, then the overall memory capacity is improved, but the signal transmission distance and interconnection complexity increase
Solution Approach 1:
The base die acts as an intermediary hub between the stacked semiconductor device and multiple expanded memory chips. All communications between stacked chips and expanded memory pass through the base die's physical interface circuits, which manage signal routing, timing, and protocol conversion. This intermediary approach enables extended package capacity while maintaining controlled signal transmission paths through centralized interface management.
3Adaptability or versatility
If more physical interface circuits are added to the base die to support expanded memory, then the expandability and versatility are improved, but the base die complexity and manufacturing difficulty increase
Solution Approach 1:
The interface functionality is segmented into distinct physical interface circuits on the base die, with each circuit designed as a modular unit handling specific communication protocols. This modular segmentation allows for standardized design patterns that can be replicated, simplifying the manufacturing process while maintaining high expandability. Each interface circuit can be independently verified and manufactured using standard processes.
Data Source
AI summary
A semiconductor package includes a package substrate; an interposer disposed over the package substrate; a stacked semiconductor device including a lower chip and one or more upper chips, which are sequentially stacked over the interposer; a first semiconductor chip stacked over the interposer and spaced apart from the stacked semiconductor device, and configured to interface with the lower chip; and one or more second semiconductor chips disposed over the package substrate to interface with the lower chip.