Stacked Package Mixed Conductive Ball Wire Connections
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Solution Overview
Problem
Conventional stacked packages face issues with electrical connections due to the limitations of conductive wires, which have slow signal transmission speeds and poor connections, while conductive balls provide faster connections but are more complex to form and larger in size, making them unsuitable for densely arranged semiconductor packages.
Innovation Solution
A stacked package design that uses conductive balls for connecting first and third pads and conductive wires for connecting second and fourth pads, allowing for simultaneous transmission of different signals through distinct connecting members, with each pad strategically positioned on the package substrates for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conductive wires are used to connect semiconductor packages, then the package size can be reduced, but the electrical connection quality deteriorates
Solution Approach 1:
The patent applies different connecting member types (conductive balls vs. conductive wires) to different connection locations based on local requirements. Conductive balls are used where high reliability is needed, while conductive wires are used where space is constrained, achieving local optimization of connection quality.
Solution Approach 2:
The patent segments the electrical connection system into two distinct types of connecting members: conductive balls for high-reliability connections and conductive wires for compact connections. This segmentation allows each type to be optimized for its specific function rather than using a single universal connecting member.
2Speed
If conductive balls are used to connect semiconductor packages, then the signal transmission speed improves, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the connection system into two segments: conductive balls for high-speed signal transmission and conductive wires for general connections. This segmentation allows conductive balls to be used selectively only where high speed is required, reducing overall manufacturing complexity while maintaining performance where needed.
Solution Approach 2:
Conductive balls are applied locally at specific connection points where rapid signal transmission is critical, rather than using them universally. This localized application reduces manufacturing complexity while achieving the speed benefit where most needed.
3Reliability
If conductive balls are used to connect minutely arranged pads, then the electrical connection quality improves, but the pad arrangement density decreases
Solution Approach 1:
The patent uses conductive balls locally at specific pad locations where high connection quality is required, while using conductive wires at other locations where space is more constrained. This allows dense pad arrangement to be maintained while achieving high reliability at critical connection points.
Solution Approach 2:
The connection system is segmented into conductive balls for high-reliability connections and conductive wires for compact connections, allowing dense pad arrangement to be achieved by using the smaller conductive wires where space is limited while maintaining connection quality where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient signal transmission with conductive balls and wires, ensuring reliable electrical connections while maintaining a compact package size by leveraging the strengths of both methods and simplifying the manufacturing process.
Implementation Method 1
A conductive ball electrically connects the first conductive pad of the first package substrate and the third conductive pad of the second package substrate
Implementation Method 2
A conductive wire electrically connects the second conductive pad of the first package substrate and the fourth conductive pad of the second package substrate
Data Source
AI summary
A stacked package for an electronic device and a method of manufacturing the stacked package include a first semiconductor package being formed with a first conductive pad and a second conductive pad. A second semiconductor package is formed with a third conductive pad and a fourth conductive pad and is disposed over the first semiconductor package. A first conductive connecting member electrically connects the first conductive pad and the third conductive pad. A second conductive connection member electrically connects the second conductive pad and the fourth conductive pad.