Stacked Semiconductor Package With Transparent Optical Encapsulation
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Solution Overview
Problem
Current semiconductor packaging techniques face challenges in efficiently integrating System-on-Integrated-Circuit (SoIC) components due to issues related to packaging processes, particularly in achieving miniaturization, higher speed, greater bandwidth, and lower power consumption.
Innovation Solution
A semiconductor package design involving a photonic integrated circuit die with optical components, an electric die with active and passive components, and a die without circuit components, stacked and bonded using hybrid bonding and encapsulated with a transparent material to facilitate optical signal transmission and reduce thermal warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional packaging techniques are used for SoIC components, then manufacturing process is simpler, but integration density and miniaturization are insufficient
Solution Approach 1:
The patent implements nested packaging by placing multiple semiconductor dies (first die, second die, third die) within a single package substrate, with dies stacked vertically and laterally arranged. This nesting approach achieves high integration density by utilizing three-dimensional space efficiently, allowing multiple functional components to coexist in a compact volume while maintaining individual die integrity and functionality.
Solution Approach 2:
The patent transitions from traditional two-dimensional planar packaging to three-dimensional stacked packaging. Multiple dies are arranged not only laterally but also vertically stacked with different orientations (first die in first orientation, second die in second orientation). This dimensional expansion dramatically increases integration density without proportionally increasing the package footprint, resolving the contradiction between miniaturization and manufacturing complexity.
2Speed
If multiple dies are stacked to increase bandwidth, then transmission speed improves, but thermal management becomes more difficult
Solution Approach 1:
The patent assigns different functional roles to different dies and their corresponding surfaces: signal transmission functions are concentrated on the first surface of each die, while thermal dissipation functions are concentrated on the second surface with heat dissipation structures. This local quality differentiation allows the package to simultaneously achieve high transmission speed through optimized signal paths and effective thermal management through dedicated heat dissipation surfaces, resolving the contradiction between speed and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding density, improves transmission speed and bandwidth, and reduces energy consumption by utilizing hybrid bonding and transparent encapsulation to manage thermal expansion differences.
Implementation Method 1
a material of the second die has a first thermal expansion coefficient, a material of the third die has a second thermal expansion coefficient, and a material of the transparent encapsulation material has a third thermal expansion coefficient
Data Source
AI summary
A semiconductor package includes a first die, a second die overlying the first die, and a transparent encapsulation material extending along a sidewall of the second die. The first die includes an optical element and a first conductive pad. The second die includes a transparent portion and a second conductive pad connected to the first conductive pad, and the second conductive pad is offset from the transparent portion in a top view.