Stacked Semiconductor Package Pad Layout for Heat and Stability
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving structural stability, thermal radiation efficiency, and operating stability, particularly in multi-chip stacked configurations.
Innovation Solution
A semiconductor package design featuring a first die with a central region and peripheral region, through electrodes, and connection terminals with convex portions, along with a dielectric layer, to enhance structural stability and thermal radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multi-chip stacked package technique is used to achieve compact and high-performance products, then functionality and performance are improved, but structural stability deteriorates due to increased thickness and complexity
Solution Approach 1:
The patent divides the connection terminals into different types (first connection terminals and second connection terminals) with different structures. First connection terminals have convex portions protruding from lateral surfaces, while second connection terminals have recessed portions. This segmentation allows different regions of the stacked package to have optimized connection structures, improving overall structural stability while maintaining high functionality.
Solution Approach 2:
The patent applies different pad width designs in different regions of the dies. Central region pads have larger widths for better electrical connection and heat dissipation, while peripheral region pads have smaller widths. This local quality approach optimizes both electrical performance and structural stability in different areas of the multi-chip package.
2Stability of the object's composition
If connection terminals are designed with convex portions protruding beyond pad lateral surfaces, then structural stability is improved, but ease of manufacture deteriorates due to increased manufacturing complexity
Solution Approach 1:
The convex portions of the connection terminals are formed during the terminal fabrication process itself, before assembly. This preliminary action integrates the structural reinforcement feature into the manufacturing flow without requiring additional post-assembly steps, thus improving structural stability while minimizing impact on manufacturing ease.
3Reliability
If pad widths in central region are increased to improve electrical connection, then electrical stability is improved, but thermal radiation efficiency deteriorates due to reduced heat dissipation area
Solution Approach 1:
The patent implements different pad widths for different regions: central region pads have larger widths for optimal electrical connection and stability, while peripheral region pads have smaller widths that allow better heat dissipation. This local differentiation resolves the contradiction by optimizing each region for its primary function.
Solution Approach 2:
The die surface is segmented into central and peripheral regions with different pad designs. This segmentation allows the central region to focus on electrical performance while the peripheral region focuses on thermal management, thereby resolving the contradiction between electrical stability and thermal radiation efficiency.
4Stability of the object's composition
If connection terminals have convex portions protruding beyond pad surfaces, then structural stability is improved, but risk of electrical short deteriorates due to increased proximity between adjacent terminals
Solution Approach 1:
The patent differentiates between first connection terminals with convex portions and second connection terminals with recessed portions. This segmentation allows strategic placement of convex portions in regions where they provide structural benefit without creating short-circuit risks, while recessed portions are used where electrical isolation is critical.
Solution Approach 2:
The connection terminals exhibit asymmetric design with convex portions on specific sides and recessed portions on others. This asymmetric structure optimizes both structural stability and electrical isolation by directing protrusions away from adjacent terminals while maintaining strong mechanical connections where needed.
Data Source
AI summary
A semiconductor package comprises a first die having a central region and a peripheral region that surrounds the central region; a plurality of through electrodes that penetrate the first die; a plurality of first pads at a top surface of the first die and coupled to the through electrodes; a second die on the first die; a plurality of second pads at a bottom surface of the second die, the bottom surface of the second die facing the top surface of the first die; a plurality of connection terminals that connect the first pads to the second pads; and a dielectric layer that fills a space between the first die and the second die and surrounds the connection terminals. A first width of each of the first pads in the central region may be greater than a second width of each of the first pads in the peripheral region.