Stacked Semiconductor Package Pads for Heat Dissipation Reliability
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high integration, high speed, and reliable operation while effectively dissipating heat, which are crucial for miniaturized and multifunctional electronic products.
Innovation Solution
A semiconductor package design featuring stacked semiconductor chips with specific configurations of signal and dummy pad structures, including through electrodes, cover layers, and dummy conductive layers, which enhance electrical connectivity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are stacked to achieve high integration, then the number of devices per unit area increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking of semiconductor chips. Multiple chips are arranged vertically along the thickness direction, with bonding pads and through-electrodes enabling electrical connections between stacked chips. This dimensional change increases integration density while providing multiple heat dissipation paths through the stack structure.
Solution Approach 2:
The patent divides the semiconductor system into multiple independent chips that can be stacked. Each chip is a separate unit with its own bonding pads, allowing independent optimization of heat dissipation for each chip while maintaining high integration through the stacked configuration.
2Reliability
If the number of bonding pads is increased to support more through-electrodes, then electrical connectivity improves, but manufacturing complexity increases
Solution Approach 1:
The patent introduces dummy bonding pads with different configurations - some bonding pads have the same width as signal bonding pads, while others have different widths. This local differentiation allows optimization of electrical connectivity in specific regions without uniformly increasing complexity across the entire chip structure.
Solution Approach 2:
The patent varies the width parameter of bonding pads to create different types (signal bonding pads vs. dummy bonding pads with different widths). This parameter change enables flexible configuration of electrical connections while maintaining manufacturing feasibility through standardized fabrication processes.
3Reliability
If dummy pad structures with different widths are implemented, then heat dissipation and electrical connectivity are optimized, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements dummy bonding pads with different widths at specific locations to optimize local heat dissipation and electrical connectivity. The first dummy bonding pads have the same width as signal bonding pads, while the second dummy bonding pads have different widths, allowing localized optimization without requiring high precision across the entire structure.
Solution Approach 2:
The patent uses dummy bonding pads that extend beyond the minimum required dimensions for electrical connectivity. These oversized dummy pads provide additional thermal pathways and ensure adequate electrical connection margins, improving reliability while using standard manufacturing tolerances.
Data Source
AI summary
A semiconductor package includes a first semiconductor chip including a first semiconductor substrate having a first active surface and a first inactive surface opposite to each other, a plurality of through electrodes penetrating the first semiconductor substrate, and a rear cover layer covering the first inactive surface, a second semiconductor chip stacked on the first semiconductor chip and including a second semiconductor substrate having a second active surface and a second inactive surface opposite to each other, and a front cover layer covering the second active surface, a plurality of signal pad structures penetrating the rear cover layer and the front cover layer to be electrically connected to the plurality of through electrodes, and a plurality of dummy pad structures apart from the plurality of signal pad structures in a horizontal direction, and penetrating the rear cover layer and the front cover layer.