Semiconductor Stacked Package With Intermediate Routing Pads
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Solution Overview
Problem
In semiconductor stacked packages, the long length of bonding wires can lead to issues such as short-circuiting and reduced electrical connection reliability due to increased wire length, necessitating the use of connection pads as intermediate routing points to mitigate these problems.
Innovation Solution
Incorporating blocking circuits between connection pads and second circuit units that are not used at the package level, allowing these pads to function as intermediate routing points for bonding wires, and using a dummy pad enable signal to electrically disconnect them when necessary, thereby reducing wire length and preventing unwanted connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to connect semiconductor chips and substrate, then electrical connection is achieved, but wire length increases leading to short-circuit risk and reduced reliability
Solution Approach 1:
The bonding wire connection path is segmented into multiple sections by introducing intermediate connection pads on the semiconductor chips. Instead of a single long wire直接从chip到substrate, the connection is divided into shorter segments: chip bonding pad → bonding wire → intermediate connection pad → bonding wire → substrate coupling pad. This segmentation reduces the length of each individual wire segment and lowers short-circuit risk.
Solution Approach 2:
Intermediate connection pads are introduced as mediator elements between the semiconductor chip bonding pads and the substrate coupling pads. These intermediate pads serve as routing points that enable shorter bonding wire connections while maintaining electrical connectivity. The intermediate pads act as mediators that break the direct long-distance connection into manageable shorter segments.
2Reliability
If connection pads are used as intermediate routing points to reduce wire length, then reliability improves, but pad overcrowding may occur reducing design efficiency
Solution Approach 1:
Different types of pads are assigned to different functional zones on the semiconductor chip. First circuit units (used at package level) are connected to bonding pads that interface with bonding wires, while second circuit units (not used at package level) are connected to connection pads that serve as intermediate routing points. This local differentiation optimizes pad usage in specific regions and prevents unnecessary pad overcrowding.
Solution Approach 2:
Connection pads serve multiple functions: they act as electrical connection points for bonding wires, serve as intermediate routing points to reduce wire length, and maintain electrical disconnection from unused second circuit units while allowing bonding wires to pass through. This multi-functionality reduces the need for additional dedicated pads, thereby preventing pad overcrowding.
3Reliability
If blocking circuits are added to electrically disconnect unused circuit units, then unwanted connections are prevented, but device complexity increases
Solution Approach 1:
Blocking circuits are designed to be dynamically controllable through enable signals. The blocking circuits can be activated or deactivated based on operational requirements, allowing flexible control over electrical connections. This dynamic control enables the system to adapt connection states without requiring permanent structural modifications, thereby managing complexity effectively.
Solution Approach 2:
The blocking circuits are integrated directly into the connection pad structure, allowing the pad itself to provide both connection and blocking functions. The blocking circuit automatically manages the electrical disconnection of unused second circuit units without requiring external control mechanisms, enabling the structure to self-regulate its connection states and reducing overall system complexity.
Data Source
AI summary
A semiconductor stacked package may include a substrate formed with a plurality of coupling pads, a plurality of semiconductor chips stacked on the substrate. The semiconductor stacked package may also include first circuit units disposed on each of the semiconductor chips, and electrically connected with the coupling pads by the medium of bonding pads. The semiconductor stacked package may include second circuit units disposed on each of the semiconductor chips and electrically disconnected with the coupling pads, connection pads disposed on each of the semiconductor chips and corresponding to the second circuit units, and blocking circuits coupled between the second circuit units and the connection pads. The semiconductor stacked package may also include bonding wires electrically connecting the bonding pads and the coupling pads.