Stacked Semiconductor Package Shielding for Thin Multi-Chip Layouts
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Solution Overview
Problem
The increasing complexity and size of semiconductor device packages pose challenges in reducing their area and thickness while maintaining performance and functionality, particularly with dual-side assembly and the integration of multiple electronic components.
Innovation Solution
The semiconductor device package design incorporates multiple substrates and electronic components arranged in specific configurations, including overlapping and stacked arrangements, with shielding layers and compartment shields to reduce area and thickness, and uses interposers and package bodies to encapsulate components while providing electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more electronic components are integrated within a single semiconductor device package to increase performance and functionality, then the package density increases, but the area of the semiconductor device package increases
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking by introducing an interposer substrate that enables vertical integration. Multiple substrates (first substrate, interposer, second substrate) are stacked in the thickness direction, allowing electronic components to be arranged in multiple layers rather than a single plane. This dimensional change enables higher component density without proportionally increasing package area.
Solution Approach 2:
The patent implements nested integration where electronic components are embedded within and between substrates. The first electronic component is disposed between the first substrate and the interposer, while the second electronic component is disposed between the interposer and the second substrate. This nesting approach allows components to occupy interstitial spaces within the stacked structure, maximizing space utilization.
2Quantity of substance
If electronic components are mounted on both surfaces of a substrate to increase package density, then the number of components increases, but the structural complexity increases
Solution Approach 1:
The patent divides the package structure into multiple functional substrates (first substrate, interposer, second substrate) that can be independently manufactured and assembled. Each substrate serves specific functions: the first substrate holds certain components, the interposer provides electrical interconnection and mechanical support, and the second substrate holds additional components. This segmentation simplifies the overall manufacturing process compared to attempting to mount all components on a single substrate.
Solution Approach 2:
The interposer acts as an intermediary substrate that facilitates electrical and mechanical connections between the first substrate and the second substrate. It provides a standardized interface that simplifies the integration of components from different sides, reducing the complexity of direct point-to-point connections that would be required without the interposer.
3Area of stationary object
If the size of the semiconductor device package is reduced to further decrease area, then the space for component placement is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
By utilizing the thickness direction (Z-axis) through multi-substrate stacking, the patent effectively redistributes component placement across multiple planes rather than constraining all components to a single reduced-area plane. This dimensional expansion in the vertical direction provides additional placement space without increasing the lateral footprint, thereby reducing the stringency of in-plane manufacturing precision requirements.
4Reliability
If shielding layers are added to prevent electromagnetic interference, then the performance is maintained, but the thickness of the semiconductor device package increases
Solution Approach 1:
The shielding function is merged with the structural substrates themselves. The first substrate, interposer, and second substrate serve dual purposes: providing mechanical support and electrical interconnection while simultaneously acting as shielding barriers against electromagnetic interference. This integration eliminates the need for separate dedicated shielding layers, thereby preventing additional thickness increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the area and thickness of semiconductor device packages while maintaining performance by optimizing component placement and using shielding to prevent interference, thereby enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate.
Data Source
AI summary
A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.