Stacked Semiconductor Package Sidewall Heat Dissipation Structure
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Solution Overview
Problem
The challenge lies in effectively dissipating heat from semiconductor packages while maintaining miniaturization and multi-functionality, especially as storage capacity increases and semiconductor chips become thinner and lighter.
Innovation Solution
A semiconductor package design incorporating a heat dissipation unit on the side surfaces of dies with high thermal conductivity, connected via redistribution structures and posts to efficiently transfer heat to the outside, utilizing materials like silicon and copper pillars for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are miniaturized to increase storage capacity and multi-functionality, then the size and weight of the package are reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a side surface heat dissipation path as a new dimension for heat removal, complementing the traditional top/bottom heat dissipation paths. The heat dissipation unit is positioned on the side surface of the package, creating a three-dimensional heat dissipation network that effectively removes heat from compact, miniaturized packages without requiring increased package volume.
Solution Approach 2:
The patent introduces a heat dissipation unit as an intermediary component between the semiconductor chip and the external environment. This unit, having high thermal conductivity, acts as a thermal bridge that efficiently transfers heat from the chip to the side surface of the package, enabling effective heat dissipation in miniaturized packages where direct heat paths are limited.
2Temperature
If heat dissipation structures are added to miniaturized packages, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat dissipation unit serves multiple functions: it acts as a thermal conductor for heat dissipation, provides structural support within the package, and can serve as a mounting platform for other components. This multi-functionality reduces the need for separate dedicated heat dissipation structures, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Solution Approach 2:
The patent merges the heat dissipation function with existing package structures. The heat dissipation unit is integrated into the package substrate or housing, combining thermal management with structural elements. This integration approach avoids adding separate complex heat dissipation mechanisms, thereby improving heat dissipation without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated from the semiconductor package, improving thermal management and maintaining compact size and functionality.
Implementation Method 1
the heat dissipation unit includes silicon having a thermal conductivity higher than a thermal conductivity of the molding unit... to transfer heat to the heat dissipation redistribution structure
Data Source
AI summary
A semiconductor package includes a first redistribution structure, a first die above the first redistribution structure, a second die above the first die, a heat dissipation unit on side surfaces of the first die or the second die, and a second redistribution structure above the second die. The semiconductor package includes a first post protruding from an upper surface of the first redistribution structure and extending to a lower surface of the second redistribution structure, a second post connecting the heat dissipation unit with a heat dissipation redistribution structure as a thermal path, and a molding unit filling an empty space between the first redistribution structure and the second redistribution structure. An outer pad of the heat dissipation redistribution structure is exposed to an outside of the semiconductor package, and an inner pad of the heat dissipation redistribution structure is in contact with the second post.