Stacked Semiconductor Package Wiring for Signal Reflection Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently connecting multiple semiconductor dies for high-capacity, low-power, and high-speed operations, particularly in stacking configurations where signal integrity is compromised due to direct bonding wire connections.
Innovation Solution
The semiconductor package design includes a first and second semiconductor die stacked with specific contact pad arrangements and interconnection lines, along with bonding wires connecting to the package substrate, allowing for efficient electrical connection while reducing signal reflection by omitting direct bonding wires to the second die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor dies are stacked and connected using bonding wires, then the capacity and integration are improved, but signal integrity deteriorates due to signal reflection
Solution Approach 1:
The patent introduces an intermediary structure (contact pad with interconnection line configuration) between the bonding wire connection point and the integrated circuit to mediate the signal transmission. This intermediary structure acts as an impedance matching element that reduces signal reflection and improves signal integrity while maintaining the stacked die configuration.
Solution Approach 2:
The patent transitions from direct bonding wire-to-IC connections to a multi-dimensional connection path that includes contact pads and interconnection lines on the die surface. This dimensional change in the connection architecture allows for optimized signal paths that reduce reflection and improve overall signal integrity in stacked die configurations.
2Ease of operation
If bonding wires are directly connected to the second semiconductor die, then electrical connection is achieved, but signal reflection increases
Solution Approach 1:
The contact pad serves as an intermediary element between the bonding wire and the integrated circuit on the second semiconductor die. This intermediary structure provides a larger connection area and optimized impedance characteristics that reduce signal reflection while maintaining reliable electrical connection.
Solution Approach 2:
The patent incorporates the contact pad and interconnection line structure into the die design before the bonding wire attachment. This preliminary configuration of the connection architecture ensures optimal signal transmission characteristics are established before the actual electrical connection is made, preventing signal reflection issues from the outset.
Data Source
AI summary
A semiconductor package includes a second semiconductor die stacked on a first semiconductor die. The first semiconductor die includes a first contact pad connected to a first integrated circuit, and includes a second contact pad connected to a third contact pad by a first interconnection line. The second semiconductor die includes a fourth contact pad connected to the third contact pad and connected to a second integrated circuit. A first bonding wire is connected to the first contact pad, and a second bonding wire is connected to the second contact pad.