Stacked Semiconductor Package Interconnect With Non-Wetting Solder Gap
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Solution Overview
Problem
Stacked semiconductor device packages face issues with short-circuitry and open-circuitry due to low tolerance to gap variations and warpage, particularly when using solder balls for electrical connections between substrates.
Innovation Solution
A semiconductor device package design featuring a conductive structure with distinct wetting and non-wetting portions, where solder materials preferentially adhere to wetting portions and are repelled by non-wetting portions, ensuring accurate solder distribution and preventing solder merging, thereby enhancing electrical connectivity and tolerance to warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder balls are used for electrical connections between substrates, then the manufacturing process is simple, but the tolerance to gap variation and warpage is low, causing short-circuitry or open-circuitry
Solution Approach 1:
The conductive structure is divided into multiple sections: a first conductive section connected to the first substrate, a second conductive section connected to the second substrate, and an intermediate non-conductive section. This segmentation allows each section to independently accommodate warpage and gap variations while maintaining electrical connectivity, thereby improving reliability without complicating the manufacturing process.
Solution Approach 2:
The conductive structure changes its physical parameters by incorporating a non-conductive section with different mechanical properties (lower modulus of elasticity) between the conductive sections. This parameter change enables the structure to flex and adapt to substrate warpage and gap variations, improving tolerance to dimensional changes while maintaining electrical functionality.
2Device complexity
If traditional conductive structures are used without non-wetting portions, then the structure is simple, but solder distribution is inaccurate and solder merging occurs, reducing manufacturing precision
Solution Approach 1:
The conductive structure incorporates portions with different surface properties: wetting portions that attract and hold solder material, and non-wetting portions that repel solder material. This local differentiation of surface quality enables precise control over solder distribution, preventing unwanted solder merging while ensuring accurate solder placement, without significantly increasing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risks of open-circuitry and short-circuitry, improves yield and reliability, and increases the tolerance to warpage and gap deviations in stacked semiconductor device packages.
Implementation Method 1
The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate.
Data Source
AI summary
A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.