Stacked Semiconductor Package With Encapsulated Spiral Inductors
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Solution Overview
Problem
As integrated circuit packages become increasingly complex with multiple device dies packaged together, there is a need for efficient methods to form semiconductor packages that optimize device performance and manufacturing costs, while also allowing for the integration of different technologies and functions within the same package.
Innovation Solution
The method involves forming a semiconductor package with a semiconductor substrate, interconnect structure, bonding structure, and encapsulant, where a die is bonded to the integrated circuit, and an inductor is formed using conductive patterns and through dielectric vias to create a spiral structure, allowing for vertical integration and reduced interference with other conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple device dies are packaged in the same package to achieve more functions, then device performance and functionality are improved, but package complexity and manufacturing difficulty increase
Solution Approach 1:
The package is divided into multiple device dies (processor die, memory die, etc.) that can be independently manufactured and then bonded together. Each die is a separate functional unit, allowing complex functionality to be achieved through composition of simpler, manageable components.
Solution Approach 2:
Multiple device dies are stacked and bonded in a vertical arrangement, with each die nested within the package structure. The dies are positioned at different vertical levels and interconnected through vertical conductive vias, creating a nested three-dimensional configuration that maximizes functionality within a compact volume.
2Ease of manufacture
If device dies with different technologies and functions are bonded to the same device die, then manufacturing cost is reduced and device performance is optimized, but manufacturing precision and bonding difficulty increase
Solution Approach 1:
Different device dies with specific functional characteristics are selectively bonded to specific locations on the package substrate. Each bonding location is optimized for the particular die type being attached, allowing different technologies to be integrated while maintaining appropriate manufacturing standards for each component.
Solution Approach 2:
The package substrate serves as a universal platform that can accommodate and bond multiple types of device dies with different technologies and functions. The substrate provides standardized bonding interfaces and interconnect structures that enable integration of diverse components through a common manufacturing process.
3Object-generated harmful factors
If inductor is formed using conductive patterns and through dielectric vias to create spiral structure, then interference with other conductive patterns is reduced, but manufacturing steps and process complexity increase
Solution Approach 1:
The inductor is formed as a three-dimensional spiral structure using vertical conductive vias that penetrate through dielectric layers. This vertical dimensionality allows the inductor traces to be stacked at different levels, reducing planar interference with other conductive patterns while achieving the required inductance through the spiral geometry.
Solution Approach 2:
Dielectric layers serve as intermediary materials between different conductive patterns and the inductor structure. These dielectric layers provide electrical isolation and mechanical support, allowing the spiral inductor to be formed without interfering with other conductive elements while maintaining manufacturability through standard semiconductor fabrication processes.
Data Source
AI summary
A semiconductor package includes a first die, a second die, an encapsulant, a first inductor and a second inductor. The second die is stacked on the first die along a first direction. The encapsulant encapsulates the second die over the first die. The first inductor is disposed in the encapsulant and has a first spiral structure, wherein the first spiral structure has a plurality of first coils around a first axis, and the first axis is substantially perpendicular to the first direction. The second inductor is disposed in the encapsulant and having a second spiral structure, wherein the first inductor and the second inductor are disposed at opposite sides of the second die.