Stacked Semiconductor Package Layout for Stress and Heat Dissipation
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving both structural and thermal stability while maintaining a compact form factor, particularly in stacked configurations.
Innovation Solution
The semiconductor package design incorporates dummy balls and substrate connection terminals with specific arrangements to distribute stress and facilitate heat dissipation, enhancing structural stability and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple semiconductor chips are stacked vertically to achieve high-density integration, then the area occupied is reduced, but structural stability deteriorates due to stress concentration on connection terminals
Solution Approach 1:
The connection structure is segmented into multiple functional regions: active connection terminals for electrical connection, dummy balls for stress distribution, and mold layers for mechanical support. This segmentation allows each region to perform its specific function optimally, preventing stress concentration on the active connection terminals while maintaining compact stacking.
Solution Approach 2:
Different regions of the package are given different properties: the center region contains dummy balls with larger contact areas for stress distribution, the first edge region has active connection terminals for electrical connection, and the second edge region provides additional structural support. This local differentiation optimizes both structural stability and electrical functionality in a compact area.
2Area of stationary object
If multiple semiconductor chips are stacked vertically to achieve high-density integration, then the area occupied is reduced, but thermal stability deteriorates due to heat accumulation
Solution Approach 1:
The package structure is segmented to include dedicated thermal management regions. The dummy balls in the center region serve dual purposes: mechanical stress distribution and thermal conduction pathways. The mold layers are positioned to facilitate heat dissipation from the semiconductor chips to the substrate, preventing heat accumulation in the stacked configuration.
Solution Approach 2:
The dummy balls and mold layers act as intermediary thermal conduction pathways between the semiconductor chips and the substrate. These intermediary structures provide thermal management functionality without requiring additional active cooling components, maintaining compact packaging while improving thermal stability.
3Area of stationary object
If connection terminals are placed close together to reduce package size, then area is reduced, but manufacturing precision deteriorates due to difficulty in precise placement
Solution Approach 1:
The connection structure is segmented into different functional zones with distinct pitch requirements. The first edge region contains active connection terminals with optimized pitch for electrical functionality, while the second edge region and center region contain dummy balls and structural elements that provide manufacturing tolerance buffer zones. This segmentation allows precise placement where needed while accommodating manufacturing variations elsewhere.
Solution Approach 2:
Different regions have different connection densities and tolerance requirements. The active connection terminal regions are designed with precise local geometry and positioning features, while the dummy ball regions provide larger spacing that is more tolerant of manufacturing variations. This local quality differentiation maintains manufacturing precision for critical connections while enabling overall package size reduction.
Data Source
AI summary
A semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view, dummy balls disposed on the center region and the second edge region of the first package, connection terminals disposed on the first edge region of the first package, and a second package including a third substrate disposed on the dummy balls and the connection terminals and a second semiconductor chip mounted on the third substrate. The dummy balls may be in contact with the second substrate and may be spaced apart from the third substrate, and the connection terminals may be coupled to the second and third substrates.