Stacked Semiconductor Package Thermal Control via Through Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in accurately measuring and controlling temperature variations, which affect performance and reliability, especially in compact electronic devices with high integration and driving frequencies.
Innovation Solution
A semiconductor package design that includes temperature sensors, power control units, and clock control elements connected via through electrodes to manage thermal management by adjusting power and clock signals based on measured temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature sensors and control units are added to the semiconductor package, then thermal management capability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the lower semiconductor chip: temperature sensing, power control, clock control, and signal routing are all integrated into a single chip that also serves as a structural support element. This merging approach adds thermal management capabilities while minimizing the increase in overall device complexity by utilizing existing structural components for multiple purposes.
Solution Approach 2:
The lower semiconductor chip is designed with multi-functionality, serving both as a structural support element and as a control unit that performs temperature sensing, power control, and clock control. This universal design allows the same component to fulfill multiple roles, improving thermal management without proportionally increasing device complexity.
2Stability of the object's composition
If power control and clock control are implemented based on temperature, then operating state stability is improved, but control system complexity increases
Solution Approach 1:
The patent implements a feedback mechanism where temperature sensors continuously monitor the temperature of upper semiconductor chips and provide this information to the lower semiconductor chip. Based on this feedback, the lower chip automatically adjusts power supply and clock signals to maintain stable operating conditions, preventing thermal runaway and ensuring reliable operation.
Solution Approach 2:
The lower semiconductor chip autonomously performs temperature monitoring, power control, and clock control without requiring external intervention. The system self-regulates by using its own temperature sensing capabilities to control its own power and clock signals, simplifying the overall control architecture while maintaining operating stability.
3Measurement precision
If temperature measurement accuracy is increased, then thermal control precision is improved, but measurement system complexity increases
Solution Approach 1:
The patent places temperature sensors in specific locations where they can directly measure the temperature of upper semiconductor chips. By positioning sensors locally near the heat-generating components and using dedicated temperature sensing elements within the lower chip, the system achieves high measurement accuracy without requiring complex distributed sensing networks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances performance and reliability by controlling temperature fluctuations, maintaining optimal operating states, and reducing power consumption in semiconductor packages.
Implementation Method 1
a plurality of temperature sensors configured to sense temperatures of the first and second upper semiconductor chips
Data Source
AI summary
Disclosed are semiconductor packages and thermal management methods thereof. The semiconductor package includes an upper semiconductor chip; and a lower semiconductor chip connected via a plurality of through electrodes to the upper semiconductor chip. The lower semiconductor chip may include at least one temperature sensor configured to sense a temperature of the upper semiconductor chip, a power control unit connected to the at least one temperature sensor, a power switching element connected to at least a first one of the plurality of through electrodes, and a clock control element connected to at least a second one of the plurality of through electrodes.