Stacked Logic-Memory Package Layout for Thermal Separation
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Solution Overview
Problem
Current semiconductor packages face challenges in heat dissipation due to the proximity of components that generate heat, such as memory controllers and physical layer interfaces, which can degrade the quality and efficiency of the package.
Innovation Solution
The semiconductor package design separates the memory controller and physical layer interface into distinct base chips, allowing them to be spaced apart and reducing thermal interference, with the memory controller in the first base chip and the physical layer interface in the second base chip, enhancing heat dissipation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If memory controller and physical layer interface are integrated in the same base chip, then device complexity is reduced, but heat dissipation performance deteriorates due to thermal interference between heat-generating components
Solution Approach 1:
The base chip is divided into two separate chips: a first base chip containing the memory controller and a second base chip containing the physical layer interface. This segmentation physically separates heat-generating components, reducing thermal interference while maintaining functional integration through vertical stacking with the memory chip stack.
2Temperature
If memory controller and physical layer interface are separated into distinct base chips, then heat dissipation performance is improved, but device complexity increases due to additional chip stacking layers
Solution Approach 1:
The separation of memory controller and physical layer interface is achieved in the vertical dimension through stacking multiple base chips and memory chip stacks, rather than increasing horizontal footprint. This three-dimensional integration manages thermal separation while maintaining compact overall package structure.
3Volume of moving object
If components are placed in close proximity to reduce package size, then miniaturization is achieved, but thermal interference increases between heat-generating components
Solution Approach 1:
The patent utilizes vertical stacking of multiple chip layers to achieve miniaturization in the horizontal plane while creating thermal separation in the vertical dimension. The first and second base chips are positioned at different vertical levels with memory chip stacks interspersed, enabling compact packaging with reduced thermal coupling.
Solution Approach 2:
By segmenting the package into multiple functional chip layers (first base chip, memory chip stack, second base chip, additional memory chip stack), the design achieves both compact overall volume and internal thermal separation. Each layer can be optimized for its specific function while maintaining close proximity for electrical interconnection.
Data Source
AI summary
A semiconductor package includes: a first base chip including a plurality of first vias; a chip stack disposed on the first base chip; and a second base chip disposed between the first base chip and the chip stack, wherein the second base chip includes a plurality of second vias, wherein the chip stack includes memory chips that are stacked on the second base chip, wherein each of the memory chips includes a plurality of third vias, and wherein the first base chip and the second base chip are logic chips.