Stacked Semiconductor Package with Through Posts for Signal Integrity
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Solution Overview
Problem
Semiconductor packages face challenges in achieving high performance, capacity, and reliability while minimizing size, weight, and power consumption, with existing designs often resulting in inefficient signal transfer paths that affect heat management and signal integrity.
Innovation Solution
The semiconductor package design incorporates a first and second redistribution substrate, a through post, and an encapsulant to create a shortened signal transfer path between upper and lower chips, utilizing a nano through-electrode and upper wiring layer to connect the chips directly, thereby improving signal integrity and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the signal transfer path between upper and lower chips is shortened, then heat is reduced and signal integrity is improved, but the device structure becomes more complex requiring additional components like through posts and redistribution substrates
Solution Approach 1:
The device is segmented into multiple functional layers including first and second redistribution substrates, upper and lower chips, and through posts. This segmentation allows the signal path to be optimized independently in each layer, shortening the overall transfer path while managing complexity through modular design
Solution Approach 2:
The signal transfer path is transitioned from a planar configuration to a three-dimensional stacked architecture. By utilizing vertical stacking with through posts penetrating the substrate and redistribution layers, the signal path is shortened in the vertical dimension while the horizontal footprint remains compact
2Productivity
If high performance and capacity are achieved through increased power consumption, then processing capability is improved, but power consumption increases which contradicts the goal of miniaturization and efficiency
Solution Approach 1:
The patent replaces traditional long-distance electrical signal transmission through substrate traces with a direct vertical connection system using through posts and redistribution substrates. This substitution reduces signal path resistance and inductance, improving processing capability while reducing power consumption associated with signal transmission
3Volume of moving object
If the semiconductor package size is reduced to meet miniaturization requirements, then portability is improved, but the signal transfer path length may increase affecting signal integrity
Solution Approach 1:
The patent transitions from two-dimensional planar signal routing to three-dimensional vertical signal paths. By stacking chips and redistribution substrates vertically with through posts providing direct connections, the signal path is shortened in the vertical dimension allowing compact packaging while maintaining signal integrity
Solution Approach 2:
Redistribution substrates and through posts serve as intermediary structures that enable direct vertical signal transmission between upper and lower chips. These intermediaries provide controlled impedance paths and reduce signal degradation that would otherwise occur in longer horizontal traces required in larger packages
Data Source
AI summary
A semiconductor package having a signal transfer path between semiconductor chips and a method of manufacturing the semiconductor package are provided. The semiconductor package includes a first redistribution substrate, a semiconductor chip stack arranged on the first redistribution substrate and including a lower chip and an upper chip, a through post arranged on the first redistribution substrate around the semiconductor chip stack, and a second redistribution substrate arranged on the semiconductor chip stack and the through post. The upper chip includes a through-electrode arranged on an integrated circuit layer, and has a front surface, which is an active face and faces the lower chip, and a back surface, which is an inactive face and faces the second redistribution substrate.