Stacked Semiconductor Package With Continuous Underfill Fillets
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high reliability and low production costs, particularly in the stacking of highly integrated semiconductor chips, where existing methods often result in interfaces between underfill fillets that compromise adhesion and increase manufacturing time and energy consumption.
Innovation Solution
The semiconductor package incorporates a package substrate with stacked semiconductor devices and underfill fillets that protrude from spaces between the devices and the substrate, forming a continuous structure without interfaces, surrounded by a molding resin, which reduces intervals between devices and enhances adhesion, thereby increasing reliability and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple underfill fillets are applied between stacked semiconductor devices, then adhesion strength is improved, but interfaces between fillets are created that compromise reliability and increase manufacturing complexity
Solution Approach 1:
The patent merges multiple separate underfill fillet applications into a single continuous underfill layer that spans across multiple semiconductor devices. This is achieved by applying underfill material that flows and consolidates to form a unified structure without interfaces, eliminating the reliability issues associated with multiple fillet interfaces while maintaining strong adhesion across all devices.
Solution Approach 2:
The patent applies underfill material in advance before final device stacking, allowing the material to naturally flow and form a continuous structure. This preliminary application ensures that when devices are stacked, the underfill already occupies the spaces between them and forms a unified adhesion layer, preventing the formation of separate fillets with interfaces.
2Strength
If multiple underfill fillets are applied between stacked semiconductor devices, then adhesion strength is improved, but manufacturing time and energy consumption increase
Solution Approach 1:
The patent combines multiple underfill application steps into a single manufacturing operation. By applying one continuous layer of underfill material that spans across all semiconductor devices, the process eliminates the need for multiple separate application, curing, and alignment steps, significantly reducing manufacturing time and energy consumption while maintaining the adhesion benefits of multiple fillets.
Solution Approach 2:
The patent implements a continuous underfill application process where the material is applied in one uninterrupted action across all devices. This continuous process eliminates the stop-start nature of multiple discrete fillet applications, maintaining productive workflow and reducing total manufacturing time while ensuring complete coverage and adhesion.
3Ease of manufacture
If semiconductor devices are stacked with larger intervals, then ease of assembly is improved, but package volume increases
Solution Approach 1:
The patent changes the physical state and distribution parameters of the underfill material to optimize the balance between assembly ease and package volume. By controlling the viscosity, flow characteristics, and consolidation behavior of the underfill, the patent enables smaller intervals between devices while still providing sufficient adhesion and allowing for easy assembly through optimized material parameters rather than relying solely on larger spacing.
Data Source
AI summary
A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.