Stacked Semiconductor Package Films for Warpage Control
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Solution Overview
Problem
As electronic components become smaller, issues such as warpage due to non-conductive films (NCF) inside semiconductor packages arise, affecting the reliability and performance of semiconductor packaging.
Innovation Solution
A semiconductor package design that includes a base substrate with stacked semiconductor chips, using a thermosetting material for the lower film and a photocurable material for the upper film, with the lower film protruding outward beyond the side surface of the first semiconductor chip to address warpage issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a non-conductive film is used between multiple semiconductor chips, then the chips can be electrically isolated and mounted on a single package wiring structure, but warpage occurs affecting reliability
Solution Approach 1:
The non-conductive film is divided into two distinct films: a lower film made of thermosetting material and an upper film made of photocurable material. Each film has different properties and functions, allowing them to compensate for each other's weaknesses and reduce overall warpage while maintaining chip stacking capability
Solution Approach 2:
The patent uses a composite structure of two different non-conductive films with distinct material properties. The thermosetting lower film provides structural support and dimensional stability, while the photocurable upper film offers flexibility and low warpage characteristics, together forming a composite system that reduces package warpage
2Reliability
If the non-conductive film is placed inside the semiconductor package, then electrical isolation is achieved, but warpage and structural integrity issues arise
Solution Approach 1:
Different regions of the non-conductive film structure have different qualities: the lower film uses thermosetting material with high structural stability for support, while the upper film uses photocurable material with low warpage properties for surface stability. This local differentiation of material properties maintains both electrical isolation and structural integrity
Solution Approach 2:
The patent changes the material parameters of the non-conductive films by selecting thermosetting material for the lower film and photocurable material for the upper film. These parameter changes in material composition and curing characteristics enable the structure to maintain dimensional stability and resist warpage while providing electrical isolation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design enhances the reliability of semiconductor packages by reducing warpage and improving the structural integrity of the package, ensuring better performance and durability.
Implementation Method 1
the lower film includes a thermosetting material
Implementation Method 2
the upper film includes a photocurable material
Data Source
AI summary
A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a second semiconductor chip on the first semiconductor chip, an upper pad on an upper surface of the first semiconductor chip, a lower pad on a lower surface of the second semiconductor chip that faces the upper surface of the first semiconductor chip, a connecting bump between the upper pad and the lower pad, a lower film on the upper surface of the first semiconductor chip, and on a side surface of the upper pad and an upper film between the lower film and the lower surface of the second semiconductor chip, and on a side surface of the lower pad, wherein the lower film includes a thermosetting material, the upper film includes a photocurable material, and a side surface of the lower film protrudes outward beyond a side surface of the first semiconductor chip.