Stacked Display Panel Interconnects for Narrow-Bezel Signal Reliability

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Solution Overview

Problem

Existing display panels face challenges in reducing the size of the non-display area while maintaining reliability and efficiency.

Innovation Solution

The display panel design includes a specific structure with a base layer and multiple resin layers, pad electrodes, barrier layers, and conductive patterns that reduce the non-display area by optimizing the layout and connections, enhancing reliability through improved signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the non-display area is reduced to increase display area, then the display area increases, but the reliability deteriorates due to insufficient space for proper signal transmission and electrical connections

Engineering Contradiction:
Improvedisplay areaVSAvoidsignal transmission reliability
Core Design Contradiction:
Area of moving objectVSReliability

Solution Approach 1:

The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture. Conductive patterns are arranged in multiple layers (first conductive pattern layer, second conductive pattern layer) with vertical connections through insulating layers. This multi-dimensional arrangement allows signal transmission paths to extend vertically, maintaining reliable electrical connections while reducing the horizontal footprint of the non-display area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where conductive patterns and insulating layers are stacked within each other vertically. The first conductive pattern is embedded in the first insulating layer, which is then covered by the second insulating layer containing the second conductive pattern. This nested arrangement maximizes space utilization, allowing multiple functional layers to occupy the same horizontal footprint while maintaining proper signal transmission paths.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If complex multi-layer structures are added to maintain reliability in reduced non-display area, then the reliability improves, but the device complexity increases

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the conductive patterns into separate functional layers: a first conductive pattern layer for primary signal transmission and a second conductive pattern layer for additional signaling or redundancy. Insulating layers are segmented to provide electrical isolation between conductive layers while maintaining structural organization. This segmentation allows each layer to be optimized for specific functions, improving reliability without requiring a completely redesign of the entire structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The multi-layer conductive and insulating structure serves multiple functions simultaneously: the first conductive pattern provides primary signal transmission, the second conductive pattern provides alternative or complementary signaling paths, and the insulating layers provide both electrical isolation and structural support. This multi-functionality allows the same structural elements to address multiple requirements (signal transmission, isolation, mechanical support) without proportionally increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20260033166A1Display panel, electronic device including the same, and method for manufacturing the display panel
Publication Date: 2026.01.29 SAMSUNG DISPLAY CO LTD
  • US20260033166A1 patent drawing
  • US20260033166A1 patent drawing
  • US20260033166A1 patent drawing

AI summary

A display panel includes a display area, a non-display area adjacent to the display area, a base layer including a first resin layer and a second resin layer defining an upper resin opening, a pad electrode between the first resin layer and the second resin layer, a driving element layer including a barrier layer defining a barrier opening, a data line above the barrier layer, a conductive pattern including a pad conductive portion, an insulating layer defining a connection opening and a main opening, and a bridge conductive pattern, and a display element layer above the second resin layer.