Vertically Stacked Passive Component Package for Lower Board Area

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Solution Overview

Problem

Existing semiconductor device packages require substantial board area and high manufacturing costs due to the need for side-by-side placement of passive components and integrated circuits, or involve costly custom assembly parts like copper clips or posts for vertical mounting, which also pose reliability issues.

Innovation Solution

A semiconductor device package design that includes a package substrate with conductive leads, a semiconductor die, and brackets extending beyond the die's thickness, covered by mold compound to expose mounts for passive components, allowing vertical stacking and integration with low-cost, reliable wedge bonding processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If passive components and integrated circuits are placed side by side on a package substrate, then board area is reduced, but manufacturing costs increase substantially

Engineering Contradiction:

Improveboard areaVSAvoidmanufacturing cost

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent transitions from planar side-by-side placement to vertical stacking by extending brackets upward from the package substrate. This dimensional change allows passive components to be mounted vertically above the semiconductor die, reducing board area while avoiding custom assembly parts that increase manufacturing cost.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nesting by placing passive components vertically above the semiconductor die within the same package footprint. The brackets extend upward to support passive components, creating a nested vertical arrangement that consolidates multiple components into a single package space without requiring additional board area or expensive custom parts.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of operation

If custom added assembly parts such as copper clips or copper posts are used for vertical mounting, then passive components can be mounted vertically, but manufacturing costs increase substantially

Engineering Contradiction:

Improvevertical mounting capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Ease of operationVSEase of manufacture

Solution Approach 1:

The package substrate serves multiple functions: it provides electrical connections, mechanical support, and vertical mounting structures through integrated brackets. These brackets are formed as part of the standard packaging process rather than as separate custom parts, enabling vertical mounting of passive components without increasing manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the mounting structure function into the package substrate itself by forming brackets as an integral part of the substrate during manufacturing. This eliminates the need for separate custom assembly parts like copper clips or posts, reducing manufacturing cost while maintaining vertical mounting capability.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If specially packaged passive components with slots for mounting semiconductor dies are used, then integration is achieved, but manufacturing costs increase substantially

Engineering Contradiction:

Improveintegration capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Instead of modifying passive components with special slots to accommodate semiconductor dies, the patent inverts the approach by providing mounting structures (brackets) on the package substrate that accommodate standard passive components. This reversal allows integration without requiring specially packaged passive components, reducing manufacturing cost.

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentUS12532786B2Semiconductor device package with vertically stacked passive component

Publication Date: 2026.01.20 TEXAS INSTRUMENTS INC

AI summary

In a described example, an apparatus includes: a package substrate with conductive leads; a semiconductor die mounted to the package substrate, the semiconductor die having a first thickness; electrical connections coupling bond pads on the semiconductor die to conductive leads on the package substrate; brackets attached to the package substrate spaced from the semiconductor die and extending away from the package substrate to a distance from the package substrate that is greater than the first thickness of the semiconductor die; and mold compound covering the package substrate, the semiconductor die, the brackets, and the semiconductor die to form a semiconductor device package having a board side surface and a top surface opposite the board side surface, and having portions of the brackets exposed from the mold compound on the top surface of the semiconductor device package to form mounts for a passive component.