Stacked Patch Antenna for 5G Signal Coverage
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Solution Overview
Problem
High-frequency 5G communication systems face challenges due to high directivity and energy loss, limiting signal transmission efficiency and coverage in both normal and non-normal directions.
Innovation Solution
A semiconductor device package with a stacked patch antenna structure, featuring multiple patches of varying lengths and dielectric layers with different dielectric constants, is used to enhance signal intensity and coverage in both normal and oblique directions by optimizing the dielectric constants to match patch lengths, allowing the antenna to respond to signals of the same frequency across various directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a conventional single-layer antenna structure is used, then the device complexity is low, but the signal intensity and coverage in multiple directions are insufficient
Solution Approach 1:
The patent transitions from a conventional single-layer (2D) antenna structure to a multi-layer stacked patch antenna structure (3D). By stacking multiple patches at different heights with different dielectric constants, the antenna achieves multi-directional signal radiation and reception, significantly improving signal intensity and coverage in both normal and oblique directions without excessively increasing device complexity
Solution Approach 2:
The patent employs composite dielectric materials with different dielectric constants (Dk values) in each layer of the stacked antenna structure. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant, creating a composite structure that optimizes signal propagation characteristics and enhances multi-directional communication performance
2Speed
If high-frequency signal transmission is implemented, then the data transfer rate is high, but the energy loss is high
Solution Approach 1:
The patent optimizes the dielectric constant parameters of each layer to match the operating frequency of 5G communication systems. By carefully selecting and adjusting the dielectric constants (Dk values) of the different dielectric layers, the antenna achieves efficient signal transmission at high frequencies while minimizing energy loss through optimized electromagnetic field distribution
3Adaptability or versatility
If a single-directional antenna is used, then the device complexity is low, but the multi-directional communication capability is insufficient
Solution Approach 1:
The stacked patch antenna structure adds the vertical dimension (z-axis) to the traditional planar antenna design. Multiple patches are positioned at different heights, creating a three-dimensional radiation pattern that enables effective communication in both normal (vertical) and oblique (angular) directions, providing true multi-directional communication capability
Solution Approach 2:
The multi-layer stacked antenna structure serves multiple functions simultaneously: it acts as both a transmitting and receiving antenna, provides omnidirectional coverage, and operates efficiently across different signal frequencies. Each layer contributes to different aspects of the radiation pattern, making the antenna universally applicable for various communication scenarios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases signal intensity and coverage in both normal and non-normal directions, addressing the limitations of high directivity and energy loss in high-frequency 5G communication systems by ensuring multi-directional communication capabilities.
Implementation Method 1
The first antenna structure includes a first patch, a second patch, a third patch, a first dielectric layer and a second dielectric layer. The second patch is disposed on the first patch. The first dielectric layer has a first dielectric constant (Dk), and is disposed between the first patch and the second patch. The third patch is disposed on the second patch. The second dielectric layer has a second dielectric constant and is disposed between the second patch and the third patch.
Data Source
AI summary
A semiconductor device package includes a circuit layer and a first antenna structure. The circuit layer includes a first surface, and a second surface opposite to the first surface. The first antenna structure is disposed on the first surface and electrically connected to the circuit layer. The first antenna structure includes a first patch, a second patch, a third patch, a first dielectric layer and a second dielectric layer. The second patch is disposed on the first patch. The first dielectric layer has a first dielectric constant (Dk), and is disposed between the first patch and the second patch. The third patch is disposed on the second patch. The second dielectric layer has a second dielectric constant and is disposed between the second patch and the third patch. The first dielectric constant is smaller than the second dielectric constant.