Stacked Patch Antenna Structure for Compact 5G Beamforming
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Solution Overview
Problem
The increasing number of antenna elements in 5G systems requires a more effective antenna structure that reduces volume, minimizes production costs, and maintains directivity while forming a target frequency band.
Innovation Solution
An antenna structure comprising a first and second metal patch on a substrate with a feeding circuit, utilizing a dielectric substrate for support and reducing the interval between patches through a protrusion and coupling structure, and incorporating an opening in the metal patches to maintain directivity and resonance frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of antenna elements is increased to meet 5G data traffic demand, then beamforming capability is improved, but the volume occupied by the antenna increases
Solution Approach 1:
The patent implements a nested structure where a first metal patch and a second metal patch are arranged in an overlapping configuration along the height direction. The first metal patch is positioned above the second metal patch with a spacing therebetween, creating a compact nested arrangement that reduces the overall antenna volume while maintaining multiple antenna elements for beamforming capability.
Solution Approach 2:
The patent transitions from a planar two-dimensional arrangement to a three-dimensional stacked configuration by arranging metal patches in the height direction. This vertical stacking approach allows multiple antenna elements to be compacted along the height axis, reducing the horizontal footprint and overall volume while preserving beamforming functionality.
2Reliability
If more antenna elements are added for massive MIMO, then communication performance is improved, but the complexity of fixing patches increases
Solution Approach 1:
The patent combines multiple functional elements into an integrated structure. The substrate serves dual purposes as both the mounting platform for metal patches and the structural support for the feeding circuit. The feeding circuit is directly formed on the substrate, merging the circuit board and antenna support functions into a single integrated component, thereby simplifying the overall assembly process.
3Volume of moving object
If antenna elements are compacted to reduce volume, then space efficiency is improved, but production cost increases
Solution Approach 1:
The patent utilizes the dielectric properties of the substrate material to achieve compact antenna design. By selecting a substrate with appropriate dielectric constant and thickness parameters, the antenna resonant frequency and impedance are optimized, allowing compact metal patch dimensions while maintaining performance. This parameter optimization enables volume reduction without requiring complex or expensive manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves a reduction in antenna volume, lowers production costs, and secures a target radiation frequency band with maintained directivity, addressing the challenges of increased antenna elements in 5G systems.
Implementation Method 1
a first capacitor is formed by the first metal patch and the second metal patch, a second capacitor is formed by the first metal patch and the ground area, and a third capacitor is formed by the second metal patch and the ground area
Implementation Method 2
forming a target frequency band while maintaining directivity of an antenna
Data Source
AI summary
The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than 4th generation (4G) communication systems such as Long-Term Evolution (LTE). According to one or more embodiments, an antenna includes: a first metal patch; a second metal patch; a feeding circuit; and a substrate. The first metal patch and the second metal patch are arranged on the substrate. The feeding circuit is coupled to the substrate and is spaced apart from the first metal patch.