Low-Profile Stacked Patch Antenna for 5G and DSRC Integration
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Solution Overview
Problem
Current dual-frequency antennas are bulky and have a high profile, making them unsuitable for integration in micro-packaging and electronic systems, and none cover both DSRC and 5G networks simultaneously.
Innovation Solution
A low-profile stacked patch multi-frequency antenna design that operates at the 5.9-GHz DSRC and 28-GHz 5G bands, featuring a stacked structure with orthogonal radiator bodies and a defected ground structure, allowing for high isolation and peak gain in a small form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional dual-frequency antennas are used, then they can cover multiple frequency bands, but they have a high profile and bulky form factor that prevents integration in micro-packaging
Solution Approach 1:
The patent transitions from planar antenna elements to a three-dimensional stacked configuration, where multiple patch antennas are arranged vertically along the z-axis. This dimensional change allows the antenna to achieve multi-frequency operation through spatial stacking rather than requiring large planar areas, thereby reducing the overall profile while maintaining frequency band coverage.
Solution Approach 2:
The patent embeds multiple antenna elements within a compact stacked structure, where each patch antenna is nested vertically above or below another. The feed networks are also integrated within the same substrate layers, creating a nested configuration that maximizes space utilization and minimizes the overall antenna volume while supporting multiple frequency bands.
2Adaptability or versatility
If stacked patch antenna structure is used, then multi-frequency operation is achieved, but isolation between frequency bands becomes challenging
Solution Approach 1:
The patent employs asymmetric feeding configurations where different feed ports are positioned at different locations and orientations on the patch antennas. The feed networks use asymmetric microstrip line configurations and impedance transformation structures that create different current distribution patterns at different frequencies, thereby reducing mutual coupling and improving isolation between frequency bands.
Solution Approach 2:
The patent utilizes parameter optimization including varying patch dimensions, substrate permittivity, feed line impedances, and spacing between stacked elements. By carefully adjusting these parameters, the antenna achieves resonance at multiple frequency bands while maintaining adequate isolation through parameter optimization rather than relying solely on physical separation.
3Adaptability or versatility
If multiple separate antennas are integrated for DSRC and 5G, then frequency coverage is achieved, but device complexity and cost increase
Solution Approach 1:
The patent designs a universal stacked patch antenna structure that can simultaneously support both DSRC (5.9 GHz) and 5G (28 GHz) operations using a single integrated antenna system. The same physical structure, substrate, and feed network infrastructure serve multiple frequency bands, eliminating the need for separate antenna assemblies and reducing overall system complexity while maintaining frequency band coverage.
Data Source
AI summary
The exemplified systems and methods provides a low-profile stacked patch multi-frequency antenna (e.g., a dual-frequency antenna). A design is disclosed which is configured to operate at the 5.9-GHz band (e.g., for Dedicated Short Range Communications) and the 28-GHz band (e.g., for 5G communications). With a low-profile, the exemplified systems and methods can be integrated into existing microelectronic packaging systems as well as readily integrated into communication systems having smaller form factor.