Stacked Patch Antenna Coupling Patterns
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Solution Overview
Problem
High-frequency band RF signals used in mmWave communications are prone to absorption and loss, degrading communication quality, requiring specialized antenna designs to enhance gain, bandwidth, and directivity.
Innovation Solution
The antenna apparatus features a stack structure with alternating conductive and dielectric layers, including patch antenna patterns, feed vias, coupling patterns, and ground vias, which improve electromagnetic coupling and radiation efficiency by adjusting spacing and configuration to enhance gain and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional antenna design is used for high-frequency band communications, then the antenna structure is simple, but the signal is easily absorbed and lost, degrading communication quality
Solution Approach 1:
The antenna is divided into multiple patch antenna patterns (first and second patch antenna patterns) arranged in a specific configuration. Each patch antenna pattern acts as an independent radiating element, and their combined arrangement improves overall antenna performance including gain and bandwidth while reducing signal loss in high-frequency band communications
Solution Approach 2:
The patent introduces a vertical stacking dimension by disposing patch antenna patterns at different heights above the ground plane. The first patch antenna pattern is disposed at a first height and the second patch antenna pattern is disposed at a second height, creating a three-dimensional antenna structure that enhances radiation efficiency and reduces signal absorption
2Reliability
If the antenna gain is increased to compensate for signal loss, then communication quality improves, but the antenna size increases
Solution Approach 1:
The antenna structure employs a nested configuration where coupling patterns are positioned between patch antenna patterns, and ground vias are integrated within the substrate. The first coupling pattern is disposed between the first and second patch antenna patterns, and the second coupling pattern is disposed between the second patch antenna pattern and the ground plane, creating a compact nested structure that achieves high gain without increasing overall antenna volume
Solution Approach 2:
By utilizing the vertical dimension with multiple patch antenna patterns at different heights and coupling patterns in between, the antenna achieves enhanced gain through three-dimensional space utilization rather than expanding in the horizontal plane, thus improving performance without increasing the antenna's footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the antenna's gain and bandwidth while reducing electromagnetic interference, improving communication quality and efficiency for high-frequency band applications.
Implementation Method 1
The antenna apparatus features a stack structure with alternating conductive and dielectric layers, including patch antenna patterns, feed vias, coupling patterns, and ground vias, which improve electromagnetic coupling and radiation efficiency
Implementation Method 2
a ground plane; a first patch antenna pattern disposed above and spaced apart from a first surface of the ground plane
Data Source
AI summary
An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.