Stacked Patch Antenna with Feed Vias for 5G mmWave Gain
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Solution Overview
Problem
High-frequency RF signals used in 5G and mmWave communications are easily absorbed and lost during transmission, leading to reduced communication quality, necessitating specialized antenna technologies for effective data transmission and reception.
Innovation Solution
The antenna apparatus includes a first patch antenna pattern with a through-hole, a second patch antenna pattern disposed above, and a coupling patch pattern, along with shielding and dummy vias, to enhance electromagnetic isolation and gain, while miniaturizing the device and improving bandwidth and data transmission rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna technology is used for high-frequency communications, then device complexity is reduced, but communication quality deteriorates due to signal absorption and loss
Solution Approach 1:
The antenna is divided into multiple patch antenna patterns (first, second, and third patch patterns) arranged in different layers. Each patch pattern functions as an independent radiating element, allowing the antenna system to achieve better performance in high-frequency bands through distributed radiation while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The patent employs a three-dimensional stacked configuration with patch antenna patterns arranged in multiple layers (first layer with first patch, second layer with second patch, third layer with third patch). This vertical dimensionality enables enhanced radiation efficiency and reduced mutual interference compared to planar configurations, directly addressing the signal loss problem in high-frequency communications.
2Reliability
If multiple patch antenna patterns are stacked to improve radiation efficiency, then communication quality improves, but device volume increases
Solution Approach 1:
The antenna structure implements a nested configuration where the first, second, and third patch antenna patterns are stacked vertically with overlapping horizontal projections. This nesting approach allows multiple radiating elements to occupy a compact vertical space, achieving enhanced radiation efficiency without proportionally increasing the overall device volume.
Solution Approach 2:
By transitioning from a two-dimensional planar arrangement to a three-dimensional stacked configuration, the patent achieves improved radiation efficiency through vertical layering. The compact vertical integration of multiple patch patterns minimizes the volume increase while maximizing the radiating surface area and reducing mutual interference between elements.
3Reliability
If feed vias are positioned closer to the center of patch antennas, then impedance matching improves, but mutual interference between adjacent antennas increases
Solution Approach 1:
The patent employs different feed via positioning strategies for different patch antenna patterns based on their specific locations and functions. The first feed via is positioned at a first position on the first patch, the second feed via at a second position on the second patch, and the third feed via at a third position on the third patch. This localized optimization allows each patch to achieve good impedance matching while the overall arrangement minimizes mutual interference between adjacent elements.
Solution Approach 2:
The feed via positions are intentionally asymmetrically distributed across the different patch antenna patterns rather than being uniformly centered. The first, second, and third feed vias are positioned at different locations relative to their respective patch centers, creating an asymmetric configuration that reduces coupling and mutual interference between adjacent antennas while maintaining adequate impedance matching for each element.
4Reliability
If shielding vias are added to reduce mutual interference, then communication quality improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding vias are integrated with the existing feed via structures and ground plane design. The first, second, and third shielding vias are positioned to overlap or align with the respective feed vias and patch patterns, combining the shielding function with the existing electrical connection pathways. This merging approach provides mutual interference reduction without requiring separate, additional manufacturing processes.
Solution Approach 2:
The shielding vias serve multiple functions simultaneously: they provide electromagnetic shielding between adjacent patch antenna patterns to reduce mutual interference, maintain ground plane integrity, and serve as additional electrical connection points. This multi-functionality reduces the need for separate shielding structures, simplifying manufacturing while achieving the desired interference reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces energy loss and mutual interference between RF signals, enhancing the gain and bandwidth of the antenna apparatus, allowing for efficient transmission and reception of RF signals in multiple frequency bands, particularly in high-frequency bands like 28 GHz and 39 GHz.
Implementation Method 1
a first feed via electrically connected to the first patch antenna pattern; a second feed via penetrating through the through-hole of the first patch antenna pattern
Implementation Method 2
a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern
Data Source
AI summary
An antenna apparatus includes a first patch antenna pattern comprising a through-hole, a second patch antenna pattern disposed above the first patch antenna pattern and spaced apart from the first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, a second feed via penetrating through the through-hole of the first patch antenna pattern, and a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feed.