Stacked Patch Antenna With Aperture Coupling Element

Solution Overview

Problem

Existing antenna designs for high-frequency applications in the millimeter-wave range face challenges in achieving wide-band, high-efficiency performance within the constraints of thin package substrates, leading to increased costs and reduced yield, while also conflicting with the goal of ultra-thin portable devices.

Innovation Solution

Incorporating a coupling element with an aperture between the upper and lower antenna elements in a stacked patch antenna configuration, which improves coupling and extends bandwidth without increasing package height, allowing for integration with high-density interconnects and maintaining thin build-up layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If thick build-up layers are used to achieve wide-band antenna designs, then antenna bandwidth is improved, but package height increases and manufacturing cost increases

Engineering Contradiction:

Improveantenna bandwidthVSAvoidpackage height

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The antenna structure is divided into multiple thin layers (first build-up layer, second build-up layer, third build-up layer) instead of using a single thick layer. Each layer has a specific thickness (e.g., 50 micrometers) that enables standard manufacturing processes while the cumulative effect achieves the required overall thickness for wide-band operation. This segmentation allows the antenna to achieve wide bandwidth through the stacked configuration of multiple resonant elements across different layers.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-layer thick structure to a multi-layer thin structure by adding vertical dimensionality. Multiple antenna elements (first patch, second patch, third patch) are stacked across different build-up layers, creating a three-dimensional antenna configuration. This dimensional change allows the antenna to achieve wide-band performance through inter-layer coupling while maintaining thin individual layers that are compatible with standard package manufacturing.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If thick build-up layers are used to achieve wide-band antenna designs, then antenna bandwidth is improved, but manufacturing cost increases

Engineering Contradiction:

Improveantenna bandwidthVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The antenna structure is divided into multiple thin layers (first build-up layer, second build-up layer, third build-up layer) instead of using a single thick layer. Each layer has a specific thickness (e.g., 50 micrometers) that enables standard manufacturing processes while the cumulative effect achieves the required overall thickness for wide-band operation. This segmentation allows the antenna to achieve wide bandwidth through the stacked configuration of multiple resonant elements across different layers.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent changes the thickness parameter of individual build-up layers from thick to thin (e.g., 50 micrometers each), making them compatible with standard package manufacturing processes. By adjusting the number of layers and their individual thicknesses, the design achieves the required cumulative thickness for wide-band antenna operation while using materials and processes that are economically viable and manufacturable with existing technology.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If thin build-up layers are used to enable thin vias and dense interconnects, then manufacturing ease is improved, but antenna bandwidth decreases

Engineering Contradiction:

Improvevia thickness and interconnect densityVSAvoidantenna bandwidth

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a single-layer thick structure to a multi-layer thin structure by adding vertical dimensionality. Multiple antenna elements (first patch, second patch, third patch) are stacked across different build-up layers, creating a three-dimensional antenna configuration. This dimensional change allows the antenna to achieve wide-band performance through inter-layer coupling while maintaining thin individual layers that are compatible with standard package manufacturing.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces coupling structures (such as coupling capacitors or coupling elements) between antenna elements on different layers to enable electromagnetic coupling. These intermediary elements facilitate energy transfer between the stacked patch elements, enabling wide-band operation through resonant coupling mechanisms while allowing the use of thin build-up layers that support dense interconnects and thin vias.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Adaptability or versatility

If multiple thin layers are used to achieve wide-band antenna designs, then antenna bandwidth is improved, but package cost increases and yield decreases

Engineering Contradiction:

Improveantenna bandwidthVSAvoidpackage cost and yield

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The antenna structure is divided into multiple thin layers (first build-up layer, second build-up layer, third build-up layer) instead of using a single thick layer. Each layer has a specific thickness (e.g., 50 micrometers) that enables standard manufacturing processes while the cumulative effect achieves the required overall thickness for wide-band operation. This segmentation allows the antenna to achieve wide bandwidth through the stacked configuration of multiple resonant elements across different layers.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent changes the thickness parameter of individual build-up layers from thick to thin (e.g., 50 micrometers each), making them compatible with standard package manufacturing processes. By adjusting the number of layers and their individual thicknesses, the design achieves the required cumulative thickness for wide-band antenna operation while using materials and processes that are economically viable and manufacturable with existing technology.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables antennas to operate over a wider bandwidth, maintaining thin build-up layers and enabling dense interconnects, thus addressing the limitations of existing designs and supporting high-frequency applications without increasing package height or cost.

Implementation Method 1

a coupling element with an aperture between the upper and lower antenna elements in a stacked patch antenna configuration, which improves coupling and extends bandwidth

Methodology Applied

Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS9853359B2Antenna integrated in a package substrate

Publication Date: 2017.12.26 INTEL CORP

AI summary

An antenna integrated in a package substrate, the antenna comprising an upper antenna element, a lower antenna element and a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element.