Stacked-Patch Antenna With Floating Ground Via for Compact RF Layout
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Solution Overview
Problem
There is a challenge in designing compact electronic devices with wireless communications capabilities that require sufficient radio-frequency performance while maximizing the display area by minimizing the space occupied by antennas.
Innovation Solution
The implementation of an antenna module with a substrate featuring transmission line layers and antenna layers separated by a ground layer, including a directly fed patch and parasitic patches, coupled by a feed via and a floating ground via that shorts the parasitic and directly fed patches at the radiating frequency, allowing for efficient wireless communication with minimal space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If antenna size is reduced to maximize display area, then device form factor is improved, but radio-frequency performance deteriorates
Solution Approach 1:
The patent implements a stacked-patch antenna configuration where multiple parasitic patches are nested vertically above the directly-fed patch. This nested arrangement allows the antenna to maintain adequate RF performance through multi-layer resonance structures while occupying minimal planar space on the substrate, thereby maximizing display area without compromising radio-frequency performance.
Solution Approach 2:
The patent transitions from a conventional planar antenna layout to a three-dimensional stacked configuration. By adding vertical dimensionality with multiple antenna layers separated by dielectric substrates, the design achieves sufficient RF performance in a compact footprint, enabling larger display areas while maintaining wireless communication capabilities.
2Ease of manufacture
If antenna structure is simplified for compact design, then manufacturing ease is improved, but RF performance deteriorates
Solution Approach 1:
The patent segments the antenna system into distinct functional layers: a directly-fed patch layer, multiple parasitic patch layers, and intermediate ground layers. Each layer is fabricated separately on the substrate using standard PCB techniques, allowing for modular manufacturing while achieving complex RF performance characteristics through the stacked configuration.
Solution Approach 2:
The ground layers in the stacked antenna structure serve multiple functions simultaneously: they provide electrical grounding for RF signals, act as reflective surfaces to enhance radiation efficiency, and serve as mechanical support between antenna layers. This multi-functionality maintains RF performance without adding separate components, simplifying the overall manufacturing process.
3Reliability
If ground via is connected to ground layer at DC, then grounding effectiveness is improved, but DC signal integrity deteriorates
Solution Approach 1:
The patent implements a floating ground via configuration where the ground connection is provided locally at the RF operating frequency through capacitive coupling to the ground layer, while maintaining DC isolation. This localized RF grounding effectiveness is achieved without creating DC signal paths, thereby preserving DC signal integrity while ensuring proper RF grounding for antenna operation.
Solution Approach 2:
The floating ground via structure changes the electrical parameters of the grounding connection based on frequency: at DC frequencies, the via remains isolated to preserve signal integrity, while at RF operating frequencies, capacitive coupling provides effective grounding. This parameter change allows the same structure to serve different functions at different frequency ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables effective wireless communication with minimal space usage, allowing for larger display areas in electronic devices by optimizing antenna performance without compromising radio-frequency efficiency.
Implementation Method 1
A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in the ground layer. The landing pad may short the floating ground via and thus the additional parasitic patch and the directly fed patch to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating with respect to the ground layer at DC frequencies.
Data Source
AI summary
An electronic device may be provided with an antenna module having a substrate. An antenna may be disposed on the substrate. The antenna may have a directly fed patch and parasitic patches. The antenna may be fed by a feed via. The parasitic patches may include a first layer of parasitic patches separated by a gap overlapping the directly fed patch. The parasitic patches may include an additional parasitic patch formed in a second layer. The additional parasitic patch may overlap the gap. A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in a ground layer. The landing pad may short the via to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating at DC frequencies.