Stacked PCB Antenna Assembly for Massive MIMO Heat Management
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Solution Overview
Problem
Current antenna devices employing massive MIMO technology face challenges in reducing size, weight, and heat generation, which affect transmission accuracy and efficiency due to increased power consumption and heat dissipation issues.
Innovation Solution
A compact and lightweight stacked structure for the antenna assembly, featuring a first printed circuit board with antenna elements and cavity filters, and a second PCB with a power amplifier, digital processing circuit, and calibration network, arranged in distinct areas to minimize heat concentration and enhance cooling performance through surface contact connections and strategic heat sink placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of antennas is increased for massive MIMO technology, then channel capacity and data transmission capability are improved, but device size, weight, and heat generation increase
Solution Approach 1:
The antenna device is divided into multiple independent antenna elements (first antenna element, second antenna element, etc.) that can be separately mounted on different PCBs. This segmentation allows the system to achieve massive MIMO capability through multiple elements while maintaining manageable individual component sizes and weights.
Solution Approach 2:
The patent transitions from 2D antenna arrangement to 3D spatial configuration by stacking multiple PCBs with antenna elements in different layers and orientations. This three-dimensional arrangement enables massive MIMO functionality with improved space utilization, allowing more antenna elements to be packed into a compact volume without proportionally increasing weight.
2Area of stationary object
If high power is used to expand coverage in massive MIMO, then coverage area is improved, but power consumption and heat generation increase
Solution Approach 1:
Different PCBs and antenna elements are configured with different power amplifier arrangements - some PCBs have power amplifiers integrated while others rely on signal from adjacent PCBs. This local quality differentiation allows optimized power distribution across the antenna array, reducing overall power consumption while maintaining adequate coverage.
Solution Approach 2:
The patent introduces signal transmission lines and coupling structures as intermediaries that allow antenna elements on different PCBs to share transmitted signals. This intermediary approach enables one power amplifier to serve multiple antenna elements indirectly, reducing the total number of power amplifiers needed and thus lowering overall power consumption.
3Device complexity
If multiple components are integrated on a single PCB, then device complexity is reduced, but heat concentration increases and affects transmission accuracy
Solution Approach 1:
The system divides components across multiple PCBs rather than integrating everything on a single board. Each PCB contains specific components (antenna elements, filters, or power amplifiers) that are thermally isolated from each other, preventing heat concentration while maintaining manageable device complexity through modular architecture.
Solution Approach 2:
Different PCBs are designed with different thermal characteristics and component densities based on their specific functions. PCBs with power amplifiers have different thermal management requirements compared to PCBs with only passive components, allowing optimized local thermal design for each board while maintaining overall system integration.
4Volume of moving object
If antenna elements are arranged in compact stacked structure, then device size and weight are reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent arranges antenna elements and PCBs in a three-dimensional stacked configuration rather than a planar layout. This vertical stacking reduces the horizontal footprint and overall device volume while creating multiple thermal pathways through the stacked layers, improving heat dissipation efficiency despite the compact form factor.
Solution Approach 2:
By segmenting the antenna system into multiple separated PCBs stacked in space, the patent creates inherent thermal separation between heat-generating components. The air gaps and structural separations between stacked PCBs provide natural thermal isolation and dissipation pathways, allowing compact volume without compromising heat management.
Data Source
AI summary
An antenna assembly and an antenna device including the same are provided. The antenna assembly includes antenna elements, a first printed circuit board (PCB), cavity filters, and a second PCB. The first PCB has one surface provided with the antenna elements. The cavity filters are installed on the other surface of the first PCB and electrically connected to the plurality of antenna elements. The second PCB has one surface electrically connected to the cavity filters and includes at least a power amplifier, digital processing circuit, and calibration network. The second PCB includes one or more first processing areas and one or more second processing areas extending in parallel with each other. The digital processing circuit is disposed in the second processing area and not in the first processing area. The power amplifier is disposed in the first processing area and not in the second processing area.