Stacked PCB Antenna Module for 5G Path Loss Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In 5G communication systems, particularly in high-frequency bands, existing antenna modules face challenges with increased path loss and heat dissipation, which affect performance and efficiency.
Innovation Solution
The proposed antenna module design includes a stacked structure of printed circuit boards (PCBs) with a wireless communication chip and multiple antennas, optimized feed line connections, and a thermal interface material for efficient heat dissipation, reducing path loss and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If existing antenna modules are used in high-frequency bands, then signal transmission is achieved, but path loss increases and performance deteriorates
Solution Approach 1:
The patent transitions from planar antenna elements to three-dimensional stacked PCB structures with vertically arranged feed lines. This dimensional change reduces the feed line length and optimizes the current path, thereby reducing path loss and improving performance in high-frequency bands
Solution Approach 2:
The patent optimizes geometric parameters including feed line length, PCB stacking configuration, and antenna element dimensions. By carefully controlling these parameters, the design achieves reduced path loss and improved signal transmission efficiency at high frequencies
2Temperature
If existing antenna modules operate at high frequencies, then communication functionality is maintained, but heat dissipation becomes insufficient
Solution Approach 1:
The patent divides the antenna module into multiple stacked PCB layers with separated functional regions. This segmentation allows for optimized thermal pathways and prevents heat accumulation in single locations, improving overall heat dissipation efficiency
Solution Approach 2:
The patent introduces thermal interface materials between the PCB stacks and housing structure to facilitate heat transfer. These intermediary materials create efficient thermal pathways from the high-frequency circuitry to the external environment, maintaining operational efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces path loss in high-frequency bands and enhances antenna module performance by effectively dissipating heat, leading to improved signal transmission and reliability.
Implementation Method 1
a thermal interface material for efficient heat dissipation
Data Source
AI summary
The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.