Stacked Printed Circuit Alignment for Camera and Sensor Integration
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Solution Overview
Problem
Electronic devices face challenges in efficiently integrating and aligning cameras and displays with sensors, leading to misalignment issues that affect image combination and device operation, particularly in compact form factors where space is limited and noise/signal interference is a concern.
Innovation Solution
The use of printed circuit stacks with multiple layers, where sensors and electronic components like cameras and displays are physically coupled using solder and conductive connections, allowing real-time monitoring and adjustment of their alignment through orientation sensors, and embedding components within or on the layers to reduce noise and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are mounted on separate printed circuit boards, then ease of manufacture is improved, but alignment precision between cameras and sensors deteriorates
Solution Approach 1:
The patent combines multiple previously separate printed circuit boards into a single integrated printed circuit board structure. Sensors and cameras are mounted on the same PCB, eliminating alignment issues between separate boards while maintaining ease of manufacture through standardized PCB fabrication processes.
Solution Approach 2:
The patent transitions from a two-dimensional layout on separate boards to a three-dimensional stacked arrangement on a single PCB. Multiple sensor arrays and camera elements are positioned at different heights and depths within the same PCB structure, enabling precise alignment through vertical stacking rather than horizontal placement.
2Volume of moving object
If the device form factor is reduced, then compactness is improved, but signal interference between components increases
Solution Approach 1:
The patent utilizes three-dimensional space within the compact device by stacking sensor arrays and camera elements at different vertical levels on the PCB. This vertical arrangement reduces horizontal spacing requirements while maintaining adequate separation between signal paths, thereby minimizing interference in the constrained volume.
Solution Approach 2:
The patent implements localized shielding and grounding structures around specific high-frequency signal paths on the PCB. By applying electromagnetic shielding selectively to areas with potential interference issues, the design maintains compact dimensions while protecting sensitive signals from nearby components.
3Measurement precision
If sensors are positioned closer to cameras, then alignment monitoring is improved, but noise interference increases
Solution Approach 1:
The patent positions sensors in close proximity to cameras but at different vertical levels within the PCB stack. This three-dimensional arrangement allows real-time alignment monitoring through direct mechanical coupling while maintaining sufficient electromagnetic separation to minimize noise interference through the layered PCB structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the alignment and operation of cameras and displays, improves power efficiency, reduces signal interference, and conserves space within electronic devices by tightly coupling components and minimizing signal paths, thereby improving the overall performance and compactness of the devices.
Implementation Method 1
Printed circuits may be formed from stacked printed circuit layers. The printed circuit layers may be electrically coupled using solder, conductive adhesive, welds, or other connections.
Data Source
AI summary
An electronic device may have a display with an array of pixels for displaying images. The electronic device may also have a lens through which the images are viewable on the display. The display may have a display panel that is mounted to a printed circuit stack. The printed circuit stack may include multiple printed circuit layers to which components are mounted. The components may include an orientation sensor overlapped by the display panel. A camera may be mounted to a printed circuit stack and may overlap one or more electrical components such as an orientation sensor. The printed circuit stacks may include rigid and flexible printed circuits coupled together using solder and other conductive connections. Air gaps may be created between stacked printed circuit layers.