Stacked PCB Charging Surface for High-Current Wireless Charging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multi-layer printed circuit boards (PCBs) struggle to support the increasing complexity and power requirements of wireless charging devices, particularly when multiple transmitting coils are needed to provide a large area charging surface, as they often exceed the current carrying capacity and manufacturing limitations of conventional PCBs.
Innovation Solution
The use of a stack of low-cost, two-layer PCBs with additional functional layers such as electromagnetic shielding, thermal management, and sensors, configured in a honeycomb packaging arrangement with coils spanning multiple layers to distribute high-amperage current efficiently and support concurrent high-power wireless charging across a flexible charging surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional multi-layer PCBs are used to support multiple transmitting coils for large area charging, then the charging surface area is increased, but the current carrying capacity is exceeded and manufacturing complexity increases
Solution Approach 1:
The patent divides the charging system into separate functional modules: transmitting coils are mounted on a first PCB while control circuits are mounted on a second PCB. This segmentation allows each PCB to be optimized for its specific function, avoiding the complexity of integrating both functions into a single multi-layer PCB while still achieving large area coverage through multiple coils.
Solution Approach 2:
The patent transitions from a planar multi-layer PCB architecture to a three-dimensional stacked PCB architecture. By stacking multiple single-layer or double-layer PCBs vertically and connecting them through vias and connectors, the system achieves the functionality of a complex multi-layer PCB while using simpler individual layers that are easier to manufacture.
2Adaptability or versatility
If multiple transmitting coils are used to provide large area charging surface, then charging capability is improved, but current carrying capacity of conventional PCBs is exceeded
Solution Approach 1:
The patent separates the high-current transmitting coil function from the low-current control circuit function onto different PCBs. This allows the first PCB to be designed with thick copper traces and robust power handling capabilities specifically for the transmitting coils, while the second PCB handles control signals with standard trace thickness, avoiding current capacity limitations.
Solution Approach 2:
The patent applies different design qualities to different parts of the system: the first PCB uses heavy-duty power transmission design with thick copper layers for the transmitting coils, while the second PCB uses standard control circuit design. This localized optimization allows each component to operate within its optimal performance parameters without being constrained by the limitations of a unified PCB design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient power transfer to multiple devices simultaneously without the need for precise geometry or location matching, enhancing the capabilities of wireless charging devices by allowing for flexible placement and supporting higher power transmission without increased manufacturing costs or time.
Implementation Method 1
a first plurality of charging cells provided on a first surface of a first printed circuit board (PCB), each charging cell having a coil that surrounds a portion of power transfer area
Implementation Method 2
The use of a stack of low-cost, two-layer PCBs with additional functional layers such as electromagnetic shielding, thermal management, and sensors, configured in a honeycomb packaging arrangement with coils spanning multiple layers to distribute high-amperage current efficiently
Data Source
AI summary
A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.