Stacked PCB Assembly With Vertical Interconnects for Compact Packaging

The patent transitions from a conventional two-dimensional PCB layout to a three-dimensional stacked architecture. Multiple PCB assemblies are vertically stacked and interconnected through via structures, allowing signal balls and components to be distributed across multiple layers in the vertical dimension. This dimensional change enables higher functionality to be achieved without proportionally increasing the horizontal package footprint, as the vertical stacking efficiently utilizes the third dimension for component integration and interconnection.

The patent divides the conventional single flat PCB into multiple segmented PCB assemblies that are stacked vertically. Each individual PCB assembly maintains a relatively simple flat structure that is easy to manufacture using standard PCB fabrication processes. However, the overall system achieves enhanced shape flexibility and packaging density through the stacked configuration, where each segment can be independently manufactured and then assembled into the three-dimensional structure via via interconnections.

The stacked PCB architecture provides additional vertical pathways for thermal management. Heat sinks can be attached to the top surfaces of individual PCB assemblies in the stack, creating multiple thermal dissipation interfaces. The via structures that interconnect the PCB layers also serve as thermal conduction paths, allowing heat to be conducted vertically through the stack. This three-dimensional thermal management approach enables efficient heat dissipation even with high component density, as heat can be extracted from multiple locations and directions rather than relying on a single planar heat sink interface.