Stacked Printed Circuit Boards for Compact Component Integration

The patent transitions from a single-plane circuit board layout to a three-dimensional stacked configuration with multiple circuit boards arranged in vertical layers. This dimensional change allows components to be distributed across multiple levels, increasing integration capacity without expanding the device's footprint, thereby resolving the contradiction between component quantity and device area.

The patent implements a nested structure where multiple circuit boards are stacked and interconnected vertically, with each board containing electrical components. This nesting approach enables high-density component integration by utilizing vertical space efficiently, allowing the system to accommodate more components within the same horizontal area, thus improving component integration without compromising device compactness.

The patent divides the circuit board system into multiple separate boards stacked in layers, where each board can be manufactured independently using standard manufacturing processes. This segmentation allows the use of cost-effective, conventional manufacturing techniques for each individual board rather than requiring expensive high-specification single-board manufacturing, thereby reducing overall manufacturing cost while achieving high component integration through the stacked architecture.

The patent combines multiple standard-specification circuit boards into a stacked assembly that functions as an integrated high-capacity system. By merging several conventional boards with standard manufacturing capabilities into a unified stacked structure, the system achieves the component integration capability of a high-specification board while maintaining lower manufacturing costs through the use of standard manufacturing processes for each individual board.