Stacked PCB Diplexer Layout for Space-Saving RF Band Separation
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Solution Overview
Problem
Diplexers mounted on one side of a printed circuit board increase material costs and occupy internal space in electronic devices, making them prone to damage during assembly or external impact.
Innovation Solution
A diplexer is integrated into the printed circuit board using a low pass filter and high pass filter, with capacitors and inductors formed on the PCB surface, allowing for a compact and cost-effective solution that transmits and receives RF signals in multiple frequency bands via a single antenna.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a diplexer is mounted as an outer mounted component on one side of the PCB, then the diplexer can be easily assembled, but the material cost increases and the diplexer occupies internal space making it vulnerable to damage
Solution Approach 1:
The patent merges the diplexer function with the PCB structure by integrating the filtering components (capacitors and inductors) directly onto the PCB board. The PCB serves dual purposes: as the structural support and as the mounting platform for the diplexer components, eliminating the need for separate outer mounted diplexer components.
Solution Approach 2:
The PCB is designed to perform multiple functions: it serves as the structural base of the device, the mounting platform for components, and the functional element containing the diplexer filtering circuitry. This multi-functionality reduces the need for additional dedicated components and lowers material costs.
2Ease of manufacture
If a diplexer is mounted as an outer mounted component on one side of the PCB, then the diplexer can be easily assembled, but the internal space of the electronic device is reduced
Solution Approach 1:
The diplexer components are merged with the PCB structure, utilizing the PCB's internal layers and surface area. The capacitors and inductors are arranged on the PCB in a compact configuration that does not protrude significantly, thereby preserving the internal space of the electronic device.
Solution Approach 2:
The patent utilizes the third dimension (vertical stacking) by placing components on different layers of the PCB. The PCB includes multiple layers with conductive patterns and components arranged in a stacked configuration, allowing the diplexer to be integrated without occupying excessive horizontal space.
3Ease of manufacture
If a diplexer is mounted as an outer mounted component on one side of the PCB, then the diplexer can be easily assembled, but the diplexer is prone to destruction or separation when external impact or assembly stress is applied
Solution Approach 1:
The diplexer components are permanently integrated into the PCB structure through standard PCB manufacturing processes such as soldering and lamination. This merging eliminates the mechanical connection interfaces that would be vulnerable to separation, making the diplexer as reliable as the PCB itself against impact and separation forces.
4Quantity of substance
If capacitors and inductors are formed on the PCB surface, then material cost is reduced and internal space is saved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent replaces mechanical assembly of discrete diplexer components with PCB manufacturing processes. The capacitors and inductors are formed using standard PCB techniques such as printing conductive patterns, placing surface-mount components, and lamination, which are well-established industrial processes with controlled precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces material costs and internal space requirements while ensuring robustness against assembly and external impacts, enabling efficient multi-frequency RF signal transmission and reception.
Implementation Method 1
a low pass filter (LPF) configured to filter a signal received from one of the first port and the second port so as to obtain an RF signal of a low-frequency band
Implementation Method 2
a high pass filter (HPF) configured to filter a signal received from one of the first port and the third port so as to obtain an RF signal of a high-frequency band
Implementation Method 3
the LPF includes a capacitor disposed on a surface of a printed circuit board (PCB)
Implementation Method 4
the LPF includes an inductor formed in a pattern on the PCB
Data Source
AI summary
An electronic device is provided. The electronic device includes an antenna, a wireless communication circuit, and a diplexer. The diplexer includes a first port, and second and third ports connected to the wireless communication circuit, a low pass filter (LPF) configured to filter an RF signal of a low frequency band from a signal received from one of the first port and the second port and output same to the other one of the first port and the second port, and a high pass filter (HPF) configured to filter an RF signal of a high frequency band from a signal received from one of the first port and the third port and output same to the other one of the first port and the third port.