Stacked PCB ECU Heatsink Layout for Cooling and Signal Integrity

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Solution Overview

Problem

Existing electronic controller units (ECUs) face challenges in mechanical integration due to increasing complexity and size requirements, necessitating a flexible and expandable arrangement that provides effective cooling and maintains signal integrity.

Innovation Solution

The ECU configuration includes a heatsink with upper and lower cooling plates and a fluid channel, thermally coupled to multiple printed circuit boards (PCBs) via thermally conducting pedestals, allowing for direct thermal coupling and efficient cooling, while board-to-board connectors ensure electrical and communicative connections between PCBs, enabling a compact, high-density, and scalable design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a single PCB is used in traditional ECU arrangements, then the structure is simple, but the component density and cooling efficiency are limited

Engineering Contradiction:

Improvecomponent densityVSAvoidstructural complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The ECU is divided into multiple PCBs (first PCB, second PCB, third PCB) that can be independently designed and manufactured, then assembled together with the heatsink to form a modular system that achieves high component density while maintaining manufacturing simplicity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-plane PCB layout to a three-dimensional stacked arrangement where multiple PCBs are positioned at different levels around the heatsink, enabling increased component density by utilizing vertical space rather than only horizontal expansion

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If components are placed farther from the heatsink, then PCB layout is easier, but cooling efficiency decreases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidPCB layout complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Different regions of the PCBs are positioned at different distances from the heatsink based on local thermal requirements, with high-power components placed in direct thermal contact with the heatsink while less demanding components are positioned elsewhere, optimizing cooling efficiency for each specific location

Inventive Principle:

Principle #3Local quality

3Reliability

If PCBs are connected with long wiring paths, then routing is simpler, but signal integrity deteriorates

Engineering Contradiction:

Improvesignal integrityVSAvoidconnection path complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses vertical stacking of PCBs with direct face-to-face connectivity through the heatsink structure, reducing signal path lengths by eliminating long lateral routing paths and achieving shorter, more direct connection routes between components on different PCBs

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Volume of moving object

If a compact ECU design is implemented, then space utilization improves, but thermal management becomes more difficult

Engineering Contradiction:

ImproveECU volumeVSAvoidthermal management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent combines multiple PCBs and the heatsink into a single integrated assembly where the heatsink serves as both a thermal management component and a structural element that facilitates electrical connections, achieving compact design while maintaining effective cooling through direct thermal coupling of all high-power components

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration achieves improved cooling and signal integrity by allowing for a higher component density and flexibility in ECU design, enabling efficient heat transfer and reduced wiring lengths, thus addressing the challenges of increasing complexity and size requirements.

Implementation Method 1

a fluid channel arranged between the cooling plates and configured to receive a cooling fluid, wherein the cooling fluid is circulated through the channel in proximity to said cooling plates

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the cooling fluid is circulated through the channel in proximity to said cooling plates

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

each pedestal (550) is configured to provide a thermal coupling of a component (201) to a respective cooling plate, for cooling

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230413486A1Electronic controller unit

Publication Date: 2023.12.21 APTIV TECHNOLOGIES AG

AI summary

The specification provides arrangements including an electronic controller unit, ECU, comprising a heatsink, a first printed circuit board, PCB; and a second printed circuit board, PCB. A plurality of components are provided located on said PCBs. The heatsink is arranged between the first and second PCBs and is thermally coupled to the components to provide cooling. The heatsink further comprises an aperture extending through a body of the heatsink. The first PCB is directly connected to the second PCB by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.