Stacked PCB Ground Structure for RF Noise and Antenna Stability
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Solution Overview
Problem
Electronic components related to RF signal transmission on stacked printed circuit boards experience degradation due to unstable ground connections, leading to noise and unwanted waves, which affect antenna performance.
Innovation Solution
A stable ground connection structure is implemented using separate connection members to connect different ground areas, ensuring a stable path for RF signal components, and incorporating a notch filter circuit to block unwanted frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple printed circuit boards are stacked with interposers to increase component density, then the space for electronic components is improved, but the ground connection stability deteriorates
Solution Approach 1:
The ground connection structure is segmented into multiple independent ground connection paths distributed across different PCB layers and interposers. Each ground connection member provides a separate path, so if one path is disrupted, other paths maintain the ground connection, ensuring overall stability while allowing high component density on stacked PCBs.
Solution Approach 2:
Ground connection members are nested within the stacked PCB structure, with ground connections embedded in interposers between PCB layers. This nesting allows ground paths to be integrated within the compact stacked architecture without increasing external dimensions, maintaining both high density and stable ground connections.
2Ease of manufacture
If ground connections are simplified to reduce manufacturing complexity, then the ease of manufacture is improved, but the RF signal quality deteriorates due to noise and unwanted waves
Solution Approach 1:
Different regions of the ground connection structure have different properties: some areas provide low-impedance direct ground paths for RF signals, while other areas incorporate filtering elements for noise suppression. This local differentiation allows the ground structure to simultaneously simplify manufacturing in non-critical areas while providing enhanced noise filtering in critical RF signal paths.
Solution Approach 2:
Filter circuits are introduced as intermediary elements between the ground connection members and RF signal paths. These intermediaries actively suppress unwanted frequencies and noise while allowing legitimate RF signals to pass through, improving signal quality without requiring complete redesign of the ground connection structure.
3Device complexity
If separate ground areas are not connected to reduce structural complexity, then the device complexity is reduced, but the antenna performance in multiple frequency bands deteriorates
Solution Approach 1:
The ground connection structure is designed with universal connectivity, where ground connection members are configured to electrically connect multiple ground areas across different PCB layers and interposers. This universal ground network serves multiple frequency bands simultaneously, allowing a single ground structure to support diverse antenna operations without requiring separate ground systems for each frequency band.
Data Source
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AI summary
An electronic device, according to an embodiment of the present disclosure, may comprise: a housing including a first surface facing a first direction, a second surface facing a direction opposite to the first direction, and a side surface at least partially surrounding a space between the first surface and the second surface; a first printed circuit board (PCB) disposed in the housing; a second PCB which is disposed in parallel with the first PCB and includes at least one electronic component on one surface thereof; an interposer disposed between the first PCB and the second PCB; a first connection member connected to a first ground of the first PCB; a second connection member connected to a second ground of the second PCB; and a conductor which comes into electrical contact with the first connection member and the second connection member, wherein the at least one electronic component may be electrically connected to the first ground through the second connection member, the conductor, and the first connection member.