Heat Spreader for Stacked PCB Thermal Management
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Solution Overview
Problem
In stacked printed circuit board (PCB) configurations, efficient heat dissipation from processors is challenging due to the compact design of smaller devices, where internal components are closely packed, and the stacked architecture restricts effective heat transfer, particularly on the side of the processor attached to the main PCB.
Innovation Solution
Implementing a heat spreader with high thermal conductivity, connected to both the processor and a heat sink, which transfers heat from the processor through the main PCB and into an enclosed cavity, allowing for efficient heat dissipation without the need for punching holes through the PCBs, thus enabling cooling on both sides of the processor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a stacked PCB configuration is used to reduce device footprint, then the device size is reduced, but heat dissipation becomes difficult and heat is trapped inside the stacked PCB architecture
Solution Approach 1:
The patent introduces a vertical heat dissipation pathway through the stacked PCB architecture by implementing a heat spreader that extends from the first PCB through the enclosed cavity to the second PCB. This three-dimensional heat transfer approach allows heat to be conducted vertically across multiple layers rather than being confined to a single plane, effectively resolving the heat trapping issue while maintaining the compact stacked form factor
Solution Approach 2:
The heat spreader acts as an intermediary thermal conduction path between the processor on the first PCB and the external environment. By introducing this intermediate heat transfer component that spans across the enclosed cavity, the patent enables efficient heat removal from the processor without requiring direct external access to the processor surface, thus solving the heat dissipation challenge in the stacked configuration
2Temperature
If traditional cooling methods are used with stacked PCBs, then heat can be dissipated, but holes must be punched through the PCBs which creates design constraints
Solution Approach 1:
The patent merges the heat dissipation function with the existing PCB structure by integrating the heat spreader into the enclosed cavity space between the stacked PCBs. This consolidation allows heat to be transferred through the natural vertical pathways of the stacked architecture without requiring separate cooling components or modifications to the PCB structure, thereby eliminating design constraints while maintaining effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively transfers heat from the processor to a heat sink, facilitating temperature regulation in compact devices by utilizing a heat spreader that connects the processor to the main PCB and then to an external heat sink, enhancing heat transfer efficiency and eliminating design constraints associated with traditional cooling methods.
Implementation Method 1
a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration, the heat spreader configured to transfer the heat away from the processor to the heat sink
Data Source
AI summary
In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.