Stacked PCB Power Module Layout for Two-Sided Cooling
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Solution Overview
Problem
Existing power electronics modules in electric vehicles suffer from suboptimal cooling and electrical performance due to their two-dimensional layout, which limits thermal and electrical optimization.
Innovation Solution
A power electronics module design featuring two stacked printed circuit boards with conductive upper and lower layers and non-conductive middle layers, allowing for two-sided cooling and improved electrical commutation by optimizing the placement of power semiconductors and their connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power semiconductors are placed in a two-dimensional plane with phase pickups between them, then ease of manufacture is improved, but cooling efficiency deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked configuration with multiple PCB layers. Power semiconductors are mounted on both the upper and lower surfaces of the PCB, with vertical interconnections through via holes, enabling simultaneous cooling from multiple directions while maintaining manufacturing feasibility through standardized multi-layer PCB fabrication processes
2Temperature
If cooling is implemented through upper surfaces of power semiconductors with heat sinks, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates the heat sink function directly into the PCB structure by incorporating thermally conductive materials and heat dissipation pathways within the PCB layers themselves. The via holes filled with conductive material serve dual purposes as electrical interconnections and thermal conduction paths, eliminating the need for separate heat sink components attached to power semiconductor surfaces
3Reliability
If wire bonds are used to form load connections between power semiconductors, then electrical connectivity is achieved, but space is consumed limiting upward thermal conductance
Solution Approach 1:
The patent replaces the mechanical wire bond system with electrical traces etched onto the PCB copper layers. Power semiconductors on the upper and lower surfaces are electrically connected through conductive via holes that penetrate the PCB substrate, eliminating the need for wire bonds and freeing up space for improved thermal management and upward heat conduction paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design enhances cooling efficiency and electrical performance by allowing for better thermal and electrical conductivity, resulting in improved power handling and reduced losses in power electronics modules.
Implementation Method 1
The first and second printed circuit boards are place one on top of the other such that the upper layers face one another... resulting in improved cooling
Implementation Method 2
a first printed circuit board with a upper layer made of an electrically conductive material... the upper layer of the first printed circuit board forms an AC phase connection
Data Source
AI summary
A power electronics module includes first and second printed circuit boards, each having an upper and lower layer made of an electrically conductive material and a middle layer made of a non-conductive material, a high-side assembly having a power semiconductor forming a high-side switch, and a low-side assembly having a power semiconductor forming a low-side switch, wherein the first printed circuit board is placed opposite the second printed circuit board such that the upper layers face one another, wherein the upper layer of the first printed circuit board forms an AC-phase connection, and wherein the upper layer of the second printed circuit board forms a DC− and DC+ connection, and AC connections of the power semiconductors point toward and contact the upper layer of the first printed circuit board, and the DC connections for the power semiconductors point toward and contact the upper layer of the second printed circuit board.