Vehicle-Mounted Power Supply Stacked PCB Structure for Compact Cooling

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Solution Overview

Problem

The increasing volume of power conversion circuits in vehicle-mounted power supply apparatuses for electric vehicles affects the layout and structural strength of the vehicle, and the components in these circuits require a more efficient and compact design to meet the power requirements of autonomous driving and low-voltage electrical equipment.

Innovation Solution

A vehicle-mounted power supply apparatus with a stacked design of upper-layer and lower-layer PCBs, a heat sink, and a bottom housing, where the heat sink is positioned away from the upper-layer PCB, allowing for a compact and stable structure that efficiently cools and dissipates heat while providing flexible electrical connections for different voltage outputs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the power conversion circuit components are increased to meet increasing power requirements, then the power supply capability is improved, but the volume of the power supply apparatus increases rapidly

Engineering Contradiction:
Improvepower supply capabilityVSAvoidvolume of power supply apparatus
Core Design Contradiction:
PowerVSVolume of stationary object

Solution Approach 1:

The patent transitions from a planar arrangement of PCBs to a three-dimensional stacked configuration where the first PCB, second PCB, and heat sink are vertically stacked and fastened together. This spatial reorganization allows multiple functional components to occupy overlapping projection areas, significantly reducing the horizontal footprint and overall volume of the power supply apparatus while accommodating increased power conversion components

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where the heat sink is positioned between the first PCB and second PCB in the stacked configuration, with all three components fastened together as an integrated assembly. This nesting allows the heat sink to serve dual purposes: providing thermal management for power components on the PCBs while occupying minimal additional space within the stacked structure, thereby reducing overall apparatus volume

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If more components are added to the power conversion circuit, then the power conversion function is improved, but the mounting structural strength deteriorates

Engineering Contradiction:
Improvepower conversion functionVSAvoidmounting structural strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent merges the first PCB, second PCB, and heat sink into a single integrated fastened assembly where all three components are mechanically coupled together. This merging creates a unified structural unit that distributes mechanical loads across multiple components, enhancing overall mounting structural strength despite the increased number of power conversion components

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the power conversion circuit into distinct functional modules mounted on separate PCBs (first PCB for AC/DC conversion, second PCB for DC/DC conversion), which are then fastened together in a stacked configuration. This segmentation allows each PCB to be optimized for its specific function while the fastened assembly provides collective structural support, maintaining mounting strength despite increased component count

Inventive Principle:
Principle #1Segmentation

3Volume of stationary object

If the volume of the power supply apparatus is reduced, then the vehicle layout flexibility is improved, but the heat dissipation efficiency may deteriorate

Engineering Contradiction:
Improvevolume of power supply apparatusVSAvoidheat dissipation efficiency
Core Design Contradiction:
Volume of stationary objectVSTemperature

Solution Approach 1:

The patent utilizes the vertical dimension by stacking the heat sink between the first PCB and second PCB, creating a three-dimensional heat dissipation structure. This vertical arrangement allows the heat sink to access thermal energy from power components on both PCBs while maintaining a compact horizontal footprint, achieving effective heat dissipation within reduced overall volume

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat sink serves as an intermediary thermal management component positioned between the first PCB and second PCB in the stacked assembly. It captures and dissipates heat from power conversion components on both PCBs through thermal conduction and convection, enabling efficient thermal management in the compact stacked configuration without compromising heat dissipation performance

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the internal volume, enhances structural stability, and optimizes the layout of the power supply apparatus, enabling it to meet diverse power consumption needs and improve electrical isolation and safety, while maintaining efficient heat dissipation and component flexibility.

Implementation Method 1

the heat sink is located on a side that is of the upper-layer PCB and that is away from the lower-layer PCB and the heat sink is disposed between the cover and the upper-layer PCB

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentEP4404700B1Vehicle-mounted power supply apparatus and vehicle
Publication Date: 2025.08.20 HUAWEI DIGITAL POWER TECH CO LTD
  • EP4404700B1 patent drawingFigure 1~2
  • EP4404700B1 patent drawingFigure 3
  • EP4404700B1 patent drawingFigure 4~5

AI summary

This application provides a vehicle-mounted power supply apparatus and a vehicle. The vehicle-mounted power supply apparatus includes a power conversion circuit, and an upper-layer PCB, a lower-layer PCB, and a heat sink that are stacked in and fastened to a bottom housing. The heat sink, the upper-layer PCB, and the lower-layer PCB are stacked, so that internal space occupied in the vehicle-mounted power supply apparatus can be reduced. In addition, these components are fastened to the bottom housing, so that structural strength of the vehicle-mounted power supply apparatus is strong. The power conversion circuit receives external power supply through a power port, outputs a first direct current through a first direct current port, and outputs a second direct current through a second direct current port. The lower-layer PCB is electrically connected to the first direct current port, and the upper-layer PCB is electrically connected to the second direct current port and the power port. The upper-layer PCB and the lower-layer PCB that are stacked are electrically connected to different ports separately Compared with a solution in which the different ports are electrically connected to one PCB, electrical port arrangement is more flexible, so that safety of electrical isolation of the vehicle-mounted power supply apparatus is higher