Stacked PCB Layout for Phased Array Radar Heat Dissipation
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Solution Overview
Problem
Current phased array radar systems have large volumes due to direct assembly of digital and microwave parts, leading to poor heat dissipation and increased size.
Innovation Solution
A printed circuit board design integrating a microwave core board layer, digital core board layer, and heat dissipation member, with interlayer connecting paths and chip carrying areas, allowing for high integration, reduced volume, and effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If digital part and microwave part are directly assembled in physical manner, then signal transmission capability is improved, but volume increases and heat dissipation deteriorates
Solution Approach 1:
The patent merges the digital core board layer and microwave core board layer into a single integrated printed circuit board structure. The digital part and microwave part are assembled on the same board with interconnected signal paths, eliminating the need for separate physical assemblies. This integration reduces overall volume while maintaining signal transmission capability through optimized interlayer connecting paths.
Solution Approach 2:
The patent utilizes vertical stacking of board layers to arrange digital and microwave components in three-dimensional space. The digital core board layer is positioned above the microwave core board layer, with signal transmission achieving spatial separation while maintaining electrical connection through vertical connecting paths. This dimensional arrangement reduces planar footprint and overall volume.
2Reliability
If digital part and microwave part are directly assembled in physical manner, then signal transmission capability is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent extracts the heat dissipation function from the signal transmission structure by introducing a dedicated heat dissipation member. This member is positioned at the bottom of the microwave core board layer, separated from the signal transmission paths above. The heat dissipation member provides thermal management without interfering with the electrical signal transmission between digital and microwave parts.
3Adaptability or versatility
If several TR assemblies are used, then radar functionality is improved, but volume increases
Solution Approach 1:
The patent combines multiple transceiver assembly functions into a single integrated printed circuit board. Multiple chip carrying areas are defined on the microwave core board layer, allowing multiple chips to be mounted on one board. This consolidation reduces the number of separate TR assemblies needed, thereby reducing overall radar volume while maintaining full radar functionality.
Solution Approach 2:
The printed circuit board is designed with universal functionality to support multiple chips and multiple signal paths simultaneously. The interlayer connecting paths can connect to multiple chip carrying areas, enabling one board to perform the functions of multiple traditional TR assemblies. This multi-functional design reduces system volume while preserving radar capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a compact design with improved heat dissipation, reducing the overall volume of the radar system while maintaining signal transmission and reception capabilities.
Implementation Method 1
a heat dissipation member, embedded in the digital core board layer and connected to the chip carrying area
Data Source
AI summary
A printed circuit board (PCB) for a phased array antenna transceiver assembly, a transceiver assembly, and a radar are provided. The PCB includes a microwave core board layer, operating in a first frequency band, where a chip carrying area is arranged on a side of the microwave core board layer, and the chip carrying area is configured to carry a chip; a digital core board layer, operating in a second frequency band and stacked on another side of the microwave core board layer away from the chip carrying area; where an interlayer connecting path is arranged on the microwave core board layer and the digital core board layer, and the interlayer connecting path is connected to the chip carrying area; and a heat dissipation member, embedded in the digital core board layer and connected to the chip carrying area.